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S9S08DV32F2MLCR

NXP Semiconductors

S9S08DV32F2MLCR by NXP Semiconductors

MICROCONTROLLER; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;

Median Price

$5.716

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15,417 parts In-Stock

1+ parts

-

100+ parts

$5.060

1k+ parts

$4.530

10k+ parts

$4.260

15,417

-

$5.060

$4.530

$4.260

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$6.371

10,000

-

-

-

$6.371

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,165 parts In-Stock

1+ parts

$5.348

100+ parts

-

1k+ parts

-

10k+ parts

-

3,165

$5.348

-

-

-

Anansix

USA . 2,742 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,742

-

-

-

-

Vyrian

USA . 2,029 parts In-Stock

1+ parts

-

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2,029

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,438 parts In-Stock

1+ parts

$5.067

100+ parts

-

1k+ parts

-

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4,438

$5.067

-

-

-

Vigor

Singapore . 1,214 parts In-Stock

1+ parts

$8.387

100+ parts

-

1k+ parts

-

10k+ parts

-

1,214

$8.387

-

-

-

AZTECH Wire

Italy . 650 parts In-Stock

1+ parts

$21.790

100+ parts

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650

$21.790

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Perfect Parts

USA . 17,920 parts In-Stock

1+ parts

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17,920

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UNI Independent Distributors

Spain . 6,539 parts In-Stock

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6,539

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Microchip USA

USA . 3,525 parts In-Stock

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3,525

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Technical Specifications

Microcontrollers S9S08DV32F2MLCR attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

40

Peripheral IC Type:

Trade Compliance

S9S08DV32F2MLCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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