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S9KEAZN32AMLCR

NXP Semiconductors

S9KEAZN32AMLCR by NXP Semiconductors

S9KEAZN32AMLCR by NXP Semiconductors is a 32-terminal microcontroller with a max supply voltage of 5.5V and a max operating temperature of 125°C. It is commonly used in automotive applications due to its temperature grade and connectivity options such as I2C, SPI, and UART.

Median Price

$3.950

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 7,985 parts In-Stock

1+ parts

$3.300

100+ parts

$2.037

1k+ parts

$1.864

10k+ parts

$1.729

7,985

$3.300

$2.037

$1.864

$1.729

Mouser Electronics

USA . 2,117 parts In-Stock

1+ parts

$4.600

100+ parts

$2.350

1k+ parts

$1.860

10k+ parts

$1.790

2,117

$4.600

$2.350

$1.860

$1.790

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 16 parts In-Stock

1+ parts

$2.360

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16

$2.360

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Digiode

USA . 3,359 parts In-Stock

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$3.106

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3,359

$3.106

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Maritex

Poland . 1,988 parts In-Stock

1+ parts

$4.725

100+ parts

$2.653

1k+ parts

$2.204

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1,988

$4.725

$2.653

$2.204

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Chip Stock

USA . 10,040 parts In-Stock

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Vyrian

USA . 5,150 parts In-Stock

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Anansix

USA . 300 parts In-Stock

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300

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Distributors (Availability)

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Continental Prestige Electronics

USA . 5,741 parts In-Stock

1+ parts

$2.360

100+ parts

-

1k+ parts

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10k+ parts

$2.313

5,741

$2.360

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-

$2.313

Argo Parts USA

USA . 3,549 parts In-Stock

1+ parts

$2.360

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3,549

$2.360

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Netroflash

USA . 100 parts In-Stock

1+ parts

$2.360

100+ parts

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$2.242

10k+ parts

$2.195

100

$2.360

-

$2.242

$2.195

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$2.407

100+ parts

$2.407

1k+ parts

$2.407

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3,000

$2.407

$2.407

$2.407

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Vigor

Singapore . 9,921 parts In-Stock

1+ parts

$2.640

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9,921

$2.640

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Semicontronic

India . 1,565 parts In-Stock

1+ parts

$2.750

100+ parts

$2.681

1k+ parts

$2.668

10k+ parts

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1,565

$2.750

$2.681

$2.668

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Ampacity Inc.

Singapore . 1,603 parts In-Stock

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$2.780

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1,603

$2.780

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One Stop Electronics

USA . 1,553 parts In-Stock

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$2.780

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1,553

$2.780

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Corphita

USA . 2,876 parts In-Stock

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$2.943

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2,876

$2.943

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AZTECH Wire

Italy . 826 parts In-Stock

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$18.056

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826

$18.056

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Corohmni

South Africa . 551 parts In-Stock

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$24.478

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551

$24.478

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Aztec Data Supply Inc.

USA . 286 parts In-Stock

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$29.886

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286

$29.886

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QUARKTWIN TECHNOLOGY LTD

USA . 19,123 parts In-Stock

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Lixinc

USA . 12,328 parts In-Stock

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Microchip USA

USA . 4,414 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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iodParts Technologies Inc.

India . 1,427 parts In-Stock

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UNI Independent Distributors

Spain . 22 parts In-Stock

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Overview

Discover the power of innovation with the S9KEAZN32AMLCR microcontroller by NXP Semiconductors. As a leader in the industry, NXP delivers exceptional quality and reliability. This versatile device offers a wide range of applications, making it a valuable asset for any project. With its advanced features and high-performance capabilities, customers can unlock endless possibilities. From automotive to consumer electronics, this microcontroller is designed to exceed expectations. Experience seamless connectivity, precision control, and optimal performance. Embrace the future of technology with the S9KEAZN32AMLCR microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and helps protect the internal components of the microcontroller, ensuring reliability in various operating conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and enabling mass production of electronic devices.

Maximum Supply Voltage: 5.5 V

The higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of applications.

Package Shape: SQUARE

The square package shape aids in easy placement and orientation during assembly, contributing to a streamlined manufacturing process.

No. of Terminals: 32

Having a high number of terminals allows for versatile connectivity options and interfaces with external devices, expanding the functionality of the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design saves space in electronic devices, making it suitable for compact designs and applications with size constraints.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage ensures efficient power consumption and operation in low-power applications, increasing energy efficiency.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range enables the microcontroller to function reliably in harsh environments and high-temperature conditions.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for reliable operation in extreme cold conditions, making it suitable for various industrial and automotive applications.

Terminal Finish: TIN

The tin terminal finish provides corrosion resistance and ensures stable electrical connections, improving the overall performance and longevity of the microcontroller.

ADC Channels: YES

The inclusion of ADC channels enables analog-to-digital conversion, allowing the microcontroller to interface with analog sensors and signals for data acquisition and processing.

Terminal Position: QUAD

The quad terminal position facilitates easy soldering and assembly, enhancing the manufacturability and reliability of the microcontroller in electronic systems.

ROM Words: 32768

The large ROM capacity allows for storage of program instructions and data, supporting complex algorithms and applications that require extensive memory.

Width: 7 mm

The compact width of the microcontroller enables integration into small form factor devices, making it ideal for applications where space is limited.

Data EEPROM Size: 256

The EEPROM size of 256 bytes provides non-volatile memory for storing critical data and configuration settings, ensuring data retention even when power is removed.

Peripherals: COMPARATOR(2), POR, PWM(10), RTC, TIMER(12), WDT

The various peripherals such as comparators, PWM channels, RTC, and timers enhance the microcontroller's functionality, enabling precise control and timing in diverse applications.

Maximum Clock Frequency: 20 MHz

The high maximum clock frequency allows for fast processing and execution of instructions, improving the overall performance and efficiency of the microcontroller.

Maximum Time At Peak Reflow Temperature (s): 40

The specified time at peak reflow temperature ensures proper soldering and reflow processes during assembly, maintaining the integrity of the microcontroller connections.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the microcontroller's reliability and durability during the soldering process, preventing damage or malfunction.

Length: 7 mm

The compact length of the microcontroller contributes to space-saving designs and enables integration into small electronic devices or applications with size constraints.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature tolerance ensures reliable operation in automotive applications subject to extreme temperature fluctuations and environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture and microcontroller design provide efficient processing and execution of instructions, enhancing performance and responsiveness in real-time applications.

RAM Bytes: 4096

The large RAM capacity of 4096 bytes enables temporary data storage and execution of algorithms, supporting multitasking and data-intensive applications with high processing requirements.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and stable operation, making the microcontroller energy-efficient and reliable in various electronic systems.

Terminal Form: GULL WING

The gull wing terminal form facilitates surface mount soldering and enhances the mechanical strength of the connections, ensuring durability and reliability in harsh environments.

Analog To Digital Convertors: 16-Ch 12-Bit

The 16-channel 12-bit ADCs allow for precise analog-to-digital conversion, enabling accurate sensor interfacing and data acquisition in measurement and control applications.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V provides a stable power source for the microcontroller, ensuring consistent operation and performance in various electronic devices and systems.

PWM Channels: YES

The presence of PWM channels enables precise control of analog signals, making the microcontroller suitable for motor control, LED dimming, and other applications requiring pulse-width modulation.

Connectivity: I2C, SPI(2), UART(3)

The multiple connectivity options like I2C, SPI, and UART facilitate communication with external devices and peripherals, expanding the functionality and versatility of the microcontroller.

ROM Programmability: FLASH

The flash ROM allows for reprogrammability and flexibility in updating firmware and applications, enabling quick iterations and customization in the field.

Terminal Pitch: 0.8 mm

The 0.8mm terminal pitch enhances soldering accuracy and alignment during assembly, ensuring reliable connections and minimizing the risk of electrical shorts or faults.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates moderate sensitivity to moisture and proper handling requirements during storage and assembly to prevent damage or degradation of the microcontroller.

Speed: 40 rpm

The specified rotational speed of 40 rpm might be an error in the data provided for a microcontroller. This could be a reference to an application involving rotational speed control or monitoring.

On Chip Program ROM Width: 8

The on-chip program ROM width of 8 bits allows for efficient storage and retrieval of program instructions, supporting the microcontroller's computational tasks and operations.

No. of I/O Lines: 22

The substantial number of I/O lines offers flexibility in interfacing with external devices and peripherals, enabling data exchange, signal processing, and control functions in various applications.

Technical Specifications

Microcontrollers S9KEAZN32AMLCR attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

22

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

ROM Words:

32768

ROM Programmability:

FLASH

Speed:

40 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

256

Connectivity:

I2C, SPI(2), UART(3)

Peripherals:

COMPARATOR(2), POR, PWM(10), RTC, TIMER(12), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

S9KEAZN32AMLCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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