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S9KEAZ128AMLHR

NXP Semiconductors

S9KEAZ128AMLHR by NXP Semiconductors

NXP Semiconductors S9KEAZ128AMLHR microcontroller features 131072 ROM words, 16384 RAM bytes, and 16-Ch 12-Bit ADC channels. Ideal for automotive applications with CAN, I2C(2), SPI(2), UART(3) connectivity options and low power mode support.

Median Price

$2.797

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,490 parts In-Stock

1+ parts

$5.420

100+ parts

$3.060

1k+ parts

$2.700

10k+ parts

$2.250

1,490

$5.420

$3.060

$2.700

$2.250

Arrow

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.484

1,500

-

-

-

$2.484

Verical

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.484

1,500

-

-

-

$2.484

Rochester

USA . 813 parts In-Stock

1+ parts

-

100+ parts

$3.110

1k+ parts

$2.780

10k+ parts

$2.620

813

-

$3.110

$2.780

$2.620

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,171 parts In-Stock

1+ parts

$3.278

100+ parts

-

1k+ parts

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4,171

$3.278

-

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$4.600

100+ parts

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300

$4.600

-

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Chip Stock

USA . 98,500 parts In-Stock

1+ parts

-

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98,500

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-

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Vyrian

USA . 1,784 parts In-Stock

1+ parts

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1,784

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Cyclops Electronics Ltd

UK . 1,500 parts In-Stock

1+ parts

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1,500

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Anansix

USA . 1,406 parts In-Stock

1+ parts

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1,406

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,737 parts In-Stock

1+ parts

$2.480

100+ parts

$2.418

1k+ parts

$2.406

10k+ parts

-

1,737

$2.480

$2.418

$2.406

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Ampacity Inc.

Singapore . 1,713 parts In-Stock

1+ parts

$2.500

100+ parts

-

1k+ parts

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1,713

$2.500

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Vigor

Singapore . 9,695 parts In-Stock

1+ parts

$2.770

100+ parts

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9,695

$2.770

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Corphita

USA . 3,577 parts In-Stock

1+ parts

$3.105

100+ parts

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3,577

$3.105

-

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$4.508

100+ parts

-

1k+ parts

$4.328

10k+ parts

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2,000

$4.508

-

$4.328

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Continental Prestige Electronics

USA . 4,590 parts In-Stock

1+ parts

$4.600

100+ parts

-

1k+ parts

-

10k+ parts

$4.508

4,590

$4.600

-

-

$4.508

Modulus Dynamics

Lithuania . 3,232 parts In-Stock

1+ parts

$4.600

100+ parts

$4.600

1k+ parts

$4.600

10k+ parts

-

3,232

$4.600

$4.600

$4.600

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Corohmni

South Africa . 348 parts In-Stock

1+ parts

$4.600

100+ parts

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348

$4.600

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Advanced Electronics

New Zealand . 19 parts In-Stock

1+ parts

$4.738

100+ parts

$4.501

1k+ parts

$4.501

10k+ parts

-

19

$4.738

$4.501

$4.501

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Andel Nordic

Denmark . 300 parts In-Stock

1+ parts

$22.774

100+ parts

-

1k+ parts

$21.864

10k+ parts

$21.864

300

$22.774

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$21.864

$21.864

Microchip USA

USA . 4,420 parts In-Stock

1+ parts

$27.295

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4,420

$27.295

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Aztec Data Supply Inc.

USA . 215 parts In-Stock

1+ parts

$83.167

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215

$83.167

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Formix International (Excess)

India . 62,000 parts In-Stock

1+ parts

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62,000

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Infinite Electronics LLP (Excess)

. 50,001 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,811 parts In-Stock

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5,811

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Kepictronics

USA . 2,623 parts In-Stock

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2,623

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UNI Independent Distributors

Spain . 2,338 parts In-Stock

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2,338

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Argo Parts USA

USA . 931 parts In-Stock

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931

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Overview

Enhance your automotive and industrial applications with the S9KEAZ128AMLHR microcontroller by NXP Semiconductors. With a focus on quality and reliability, NXP is a trusted manufacturer known for delivering cutting-edge solutions in the microcontroller category. This versatile product offers high performance, low power consumption, and a wide range of peripherals including comparators, timers, and UART connectivity. Unlock endless possibilities and streamline your projects with the value and advantages that the S9KEAZ128AMLHR brings to your designs. Elevate your innovation today with NXP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and cost-effectiveness.

Surface Mount: YES

Enables easy integration onto circuit boards for efficient assembly.

Maximum Supply Voltage: 5.5 V

Provides flexibility in power input options for various applications.

On Chip Data RAM Width: 8

Allows for efficient data processing and storage capabilities.

Package Shape: SQUARE

This shape helps optimize space utilization on the circuit board.

No. of Terminals: 64

Offers ample connectivity options for peripheral devices.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

Ideal for compact designs and high-density mounting.

Minimum Supply Voltage: 2.7 V

Allows for operation in low-power settings or battery-powered applications.

Maximum Operating Temperature: 125 °C

Ensures reliability in harsh environmental conditions.

CPU Family: CORTEX-M0

Offers a balance of performance and energy efficiency.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold environments.

Terminal Finish: TIN

Provides good electrical conductivity and corrosion resistance.

ADC Channels: YES

Enables analog signal conversion for precise measurements.

Terminal Position: QUAD

Facilitates secure and stable connections in the circuit layout.

ROM Words: 131072

Offers large program memory for complex applications.

Maximum Seated Height: 1.6 mm

Allows for slim and compact device designs.

Width: 10 mm

Ideal for space-constrained applications.

Peripherals: COMPARATOR(2), RTC, TIMER(5), WDT

Enhances functionality and versatility in various applications.

Maximum Clock Frequency: 24 MHz

Provides high-speed operation for time-sensitive tasks.

Maximum Time At Peak Reflow Temperature: 40s

Ensures proper soldering during assembly processes.

Peak Reflow Temperature: 260°C

Compatible with standard reflow soldering techniques.

Length: 10 mm

Compact size for integration into small devices.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Offers advanced processing capabilities for versatile applications.

No. of Timers: 5

Enhances timing and scheduling functions for precise control.

RAM Bytes: 16384

Provides ample memory for data storage and manipulation.

Technology: CMOS

Offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Facilitates secure and reliable solder connections.

Analog To Digital Convertors: 16-Ch 12-Bit

Enables accurate conversion of analog signals for precise measurements.

Nominal Supply Voltage: 3 V

Suitable for a wide range of applications requiring a stable power source.

PWM Channels: YES

Allows for precise control of pulse-width modulated signals.

Connectivity: CAN, I2C(2), SPI(2), UART(3)

Offers versatile communication options for interfacing with other devices.

ROM Programmability: FLASH

Allows for flexible programming and updating of firmware.

Terminal Pitch: 0.5 mm

Allows for high-density mounting on the circuit board.

Format: FIXED POINT

Optimal for applications requiring fixed-point arithmetic calculations.

Moisture Sensitivity Level (MSL): 3

Suitable for assembly processes requiring standard moisture precautions.

Speed: 48 rpm

Ideal for applications requiring precise timing and rotational control.

Low Power Mode: YES

Enables energy-efficient operation to prolong battery life.

On Chip Program ROM Width: 8

Efficient program storage for quick access and execution.

Technical Specifications

Microcontrollers S9KEAZ128AMLHR attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

1

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

Connectivity:

CAN, I2C(2), SPI(2), UART(3)

Peripherals:

COMPARATOR(2), RTC, TIMER(5), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

S9KEAZ128AMLHR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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