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S912XET256BCAG

NXP Semiconductors

S912XET256BCAG by NXP Semiconductors

Precision designed semiconductors & electronic elements tailored for critical industrial & commercial solutions.

Median Price

-

Lifecycle Status

-

Suppliers In-Stock

3

In-Stock Inventory

1k+

S912XET256BCAG by NXP Semiconductors
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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,001 parts In-Stock

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4,001

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Vyrian

USA . 3,611 parts In-Stock

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3,611

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Anansix

USA . 1,365 parts In-Stock

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1,365

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Distributors (Availability)

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Vigor

Singapore . 3,300 parts In-Stock

1+ parts

$9.630

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3,300

$9.630

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One Stop Electronics

USA . 623 parts In-Stock

1+ parts

$175.100

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623

$175.100

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Component Stockers USA

USA . 420 parts In-Stock

1+ parts

$177.520

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420

$177.520

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Microchip USA

USA . 2,280 parts In-Stock

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2,280

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Corphita

USA . 1,990 parts In-Stock

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1,990

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Technical Specifications

Additional Parts S912XET256BCAG attributes and parameters. Explore more Additional Parts devices from NXP Semiconductors

Technical Specifications

Core Processor:

HCS12X

Other Names:

935311915557

Speed:

50MHz

Operating Temperature:

-40°C ~ 85°C (TA)

Category:

Integrated Circuits (ICs)
Embedded Microcontrollers

Program Memory Type:

FLASH

RAM Size:

16K x 8

Number of I/O:

119

Peripherals:

LVD, POR, PWM, WDT

Mounting Type:

Surface Mount

Oscillator Type:

External

Supplier Device Package:

144-LQFP (20x20)

Standard Package:

60

EEPROM Size:

4K x 8

Series:

HCS12X

Package / Case:

144-LQFP

Core Size:

16-Bit

Connectivity:

CANbus, EBI/EMI, I2C, IrDA, SCI, SPI

Program Memory Size:

256KB (256K x 8)

Package:

Tray

Data Converters:

A/D 24x12b

Voltage - Supply (Vcc/Vdd):

1.72V ~ 5.5V

Base Product Number:

S912

Moisture Sensitivity Level (MSL):

3 (168 Hours)

Trade Compliance

S912XET256BCAG Miscellaneous Components trade compliance attributes, and parameters.

ECCN

3A991A2

HTS

8542.31.0001

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Authentic purchasing experiences

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