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PXAH30KFBE,557

NXP Semiconductors

PXAH30KFBE,557 by NXP Semiconductors

MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; External Data Bus Width: 16;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,789 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,789

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-

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Digiode

USA . 2,295 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,295

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-

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Anansix

USA . 416 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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416

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 198 parts In-Stock

1+ parts

$17.065

100+ parts

-

1k+ parts

-

10k+ parts

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198

$17.065

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AZTECH Wire

Italy . 495 parts In-Stock

1+ parts

$22.000

100+ parts

-

1k+ parts

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10k+ parts

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495

$22.000

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One Stop Electronics

USA . 1,065 parts In-Stock

1+ parts

$28.000

100+ parts

-

1k+ parts

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10k+ parts

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1,065

$28.000

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-

-

Component Stockers USA

USA . 489 parts In-Stock

1+ parts

$297.310

100+ parts

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10k+ parts

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489

$297.310

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Corphita

USA . 4,280 parts In-Stock

1+ parts

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4,280

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UNI Independent Distributors

Spain . 907 parts In-Stock

1+ parts

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907

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Technical Specifications

Microcontrollers PXAH30KFBE,557 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Address Bus Width:

20

Bit Size:

16

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

32

No. of Terminals:

100

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

PXAH30KFBE,557 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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