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PTN38003AEWY

NXP Semiconductors

PTN38003AEWY by NXP Semiconductors

INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVFLGA; Package Shape: RECTANGULAR; Length: 6 mm;

Median Price

$2.945

Lifecycle Status

EOL

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 12,643 parts In-Stock

1+ parts

$0.514

100+ parts

-

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10k+ parts

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12,643

$0.514

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Chip1Stop

Japan . 12,693 parts In-Stock

1+ parts

$3.090

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-

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-

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12,693

$3.090

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Farnell

UK . 1,840 parts In-Stock

1+ parts

$3.160

100+ parts

$2.210

1k+ parts

$2.110

10k+ parts

-

1,840

$3.160

$2.210

$2.110

-

Rochester

USA . 1,070,893 parts In-Stock

1+ parts

-

100+ parts

$2.510

1k+ parts

$2.240

10k+ parts

$2.110

1,070,893

-

$2.510

$2.240

$2.110

Verical

USA . 538,893 parts In-Stock

1+ parts

-

100+ parts

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$2.800

10k+ parts

$2.638

538,893

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-

$2.800

$2.638

Flip Electronics (Authorized)

USA . 133,000 parts In-Stock

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133,000

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Element14

Singapore . 1,870 parts In-Stock

1+ parts

-

100+ parts

$7.070

1k+ parts

$6.610

10k+ parts

-

1,870

-

$7.070

$6.610

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,745 parts In-Stock

1+ parts

$2.437

100+ parts

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10k+ parts

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1,745

$2.437

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Flip Electronics

USA . 133,000 parts In-Stock

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133,000

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Component Sense

UK . 57,298 parts In-Stock

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57,298

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Vyrian

USA . 3,053 parts In-Stock

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3,053

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Anansix

USA . 2,290 parts In-Stock

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2,290

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,470 parts In-Stock

1+ parts

$2.308

100+ parts

-

1k+ parts

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10k+ parts

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1,470

$2.308

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Continental Prestige Electronics

USA . 1,870 parts In-Stock

1+ parts

$4.240

100+ parts

$3.190

1k+ parts

-

10k+ parts

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1,870

$4.240

$3.190

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AZTECH Wire

Italy . 195 parts In-Stock

1+ parts

$15.910

100+ parts

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195

$15.910

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Microchip USA

USA . 9,771 parts In-Stock

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9,771

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UNI Independent Distributors

Spain . 1,995 parts In-Stock

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1,995

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Technical Specifications

Other Function Interface ICs PTN38003AEWY attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

R-PBGA-N36

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC36,.08X.24,16

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.677 mm

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

2.1 mm

Trade Compliance

PTN38003AEWY Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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