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PTN36221AHXZ

NXP Semiconductors

PTN36221AHXZ by NXP Semiconductors

LINE TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 12; Package Code: VQCCN; Package Shape: SQUARE;

Median Price

$0.946

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 3,070 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.964

10k+ parts

$0.859

3,070

-

-

$0.964

$0.859

Rochester

USA . 2,064 parts In-Stock

1+ parts

-

100+ parts

$0.929

1k+ parts

$0.771

10k+ parts

$0.687

2,064

-

$0.929

$0.771

$0.687

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,135 parts In-Stock

1+ parts

$0.724

100+ parts

-

1k+ parts

-

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-

2,135

$0.724

-

-

-

Component Sense

UK . 11,698 parts In-Stock

1+ parts

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11,698

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Vyrian

USA . 2,633 parts In-Stock

1+ parts

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2,633

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Anansix

USA . 825 parts In-Stock

1+ parts

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825

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,766 parts In-Stock

1+ parts

$0.686

100+ parts

-

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4,766

$0.686

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-

Microchip USA

USA . 1,995 parts In-Stock

1+ parts

$1.140

100+ parts

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1,995

$1.140

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AZTECH Wire

Italy . 402 parts In-Stock

1+ parts

$19.000

100+ parts

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402

$19.000

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Perfect Parts

USA . 11,200 parts In-Stock

1+ parts

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11,200

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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10,000

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UNI Independent Distributors

Spain . 1,603 parts In-Stock

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1,603

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Technical Specifications

Line Drivers & Receivers PTN36221AHXZ attributes and parameters. Explore more Line Drivers & Receivers devices from NXP Semiconductors

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.000045 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQCC-N12

Length:

1.6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.8 V

Output Characteristics:

DIFFERENTIAL

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC12,.06SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Receive Delay:

.5 ns

Receiver No. of Bits:

1

Maximum Seated Height:

.4 mm

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Transmit Delay:

.5 ns

Width:

1.6 mm

Trade Compliance

PTN36221AHXZ Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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