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PSMN013-30LL,115

NXP Semiconductors

PSMN013-30LL,115 by NXP Semiconductors

PSMN013-30LL,115 by NXP Semiconductors is a single N-channel MOSFET ideal for power management applications. It supports a max drain current of 21 A and power dissipation of 41 W, operating efficiently up to 150 °C. This enhancement mode FET is perfect for compact surface mount designs.

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6

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Vyrian

USA . 8,477 parts In-Stock

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Digiode

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Bristol Electronics

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Atlantic Semiconductor

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Anansix

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ACDS - Activité Composants Distribution Service

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Advanced Electronics

New Zealand . 270 parts In-Stock

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$0.854

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AZTECH Wire

Italy . 474 parts In-Stock

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One Stop Electronics

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UNI Independent Distributors

Spain . 7,757 parts In-Stock

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Microchip USA

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Corphita

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Cyclops Electronics Ltd (Excess)

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Overview

Unlock superior performance with the PSMN013-30LL,115 from NXP Semiconductors! Renowned for their quality and innovation, NXP delivers this N-channel power FET designed to enhance efficiency in your applications. With its compact surface mount design and robust durability, it seamlessly integrates into various electronic systems, providing reliability where it matters most. Experience lower energy consumption and improved thermal management, making it the ideal choice for modern power solutions!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better electron mobility, resulting in lower ON resistance and higher efficiency, making them an ideal choice for high-performance applications.

Configuration: SINGLE

A single configuration allows for simpler circuit designs and easier implementation in various applications, enhancing flexibility for engineers.

Surface Mount: YES

Surface mount technology (SMT) enhances assembly efficiency and reduces the size of the circuit board, making this FET ideal for compact electronic designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides better switching characteristics, allowing the FET to be turned off completely, which improves power efficiency in various applications.

Maximum Drain Current (Abs) (ID): 21 A

With a maximum drain current of 21 A, this FET can handle significant loads, making it suitable for high-power applications and ensuring reliable performance.

Maximum Power Dissipation (Abs): 41 W

A maximum power dissipation of 41 W ensures that the FET can effectively manage heat dissipation, reducing the risk of thermal failure during operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power consumption, which minimizes overall energy costs and enhances the durability of the device.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150 °C, this FET can operate in demanding environments, making it suitable for a wide range of industrial applications.

Maximum Drain Current (ID): 21 A

The capability of handling a maximum drain current of 21 A allows for robust operation in circuits requiring high current switching, increasing design versatility.

Technical Specifications

Power Field Effect Transistors (FET) PSMN013-30LL,115 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

21 A

Maximum Drain Current (ID):

21 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

PSMN013-30LL,115 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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