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PRLL5818,115

NXP Semiconductors

PRLL5818,115 by NXP Semiconductors

PRLL5818,115 by NXP Semiconductors is a Schottky rectifier diode with max forward voltage of 0.33V and max output current of 1A. It operates at up to 125°C, making it ideal for applications requiring high efficiency and low power loss in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,957 parts In-Stock

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Anansix

USA . 2,530 parts In-Stock

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2,530

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LIBRA Elektronik GmbH

Germany . 1,711 parts In-Stock

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Digiode

USA . 828 parts In-Stock

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Nova Conductors

Japan . 52 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 15,503 parts In-Stock

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$0.034

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$0.034

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$0.094

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$0.086

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$0.077

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100

$0.094

$0.086

$0.077

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Corohmni

South Africa . 376 parts In-Stock

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$0.138

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376

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One Stop Electronics

USA . 1,332 parts In-Stock

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$1.010

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Ampacity Inc.

Singapore . 807 parts In-Stock

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$1.010

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807

$1.010

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Semicontronic

India . 655 parts In-Stock

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$1.010

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$0.985

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$0.980

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655

$1.010

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AZTECH Wire

Italy . 5,298 parts In-Stock

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$9.717

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Kepictronics

USA . 52,000 parts In-Stock

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Argo Parts USA

USA . 2,479 parts In-Stock

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UNI Independent Distributors

Spain . 2,303 parts In-Stock

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Continental Prestige Electronics

USA . 2,170 parts In-Stock

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Supply Digital

USA . 1,833 parts In-Stock

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Corphita

USA . 1,405 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Microchip USA

USA . 177 parts In-Stock

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Overview

Discover the PRLL5818,115 by NXP Semiconductors – a top-quality Schottky rectifier diode that offers reliable performance and efficiency. With a maximum forward voltage of only 0.33V and a maximum output current of 1A, this diode is perfect for a wide range of applications. Whether you're working on power supplies, converters, or battery chargers, this diode's matte tin terminal finish and glass package body material ensure durability and stability. Trust in NXP Semiconductors to provide cutting-edge technology that delivers exceptional value and benefits to your projects.

Feature Benefit Bullets

Package Body Material: GLASS

Glass packages offer high durability and reliability, making them suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and improving efficiency.

Maximum Output Current: 1 A

High maximum output current of 1A enables this diode to handle a variety of power requirements.

Technology: SCHOTTKY

Schottky diodes offer low forward voltage drop and fast switching speeds, making them ideal for high-frequency applications.

Maximum Repetitive Peak Reverse Voltage: 30 V

High maximum repetitive peak reverse voltage rating ensures reliable performance in reverse-biased conditions.

Technical Specifications

Diodes & Rectifiers PRLL5818,115 attributes and parameters. Explore more Diodes & Rectifiers devices from NXP Semiconductors

Specs

Case Connection:

ISOLATED

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

.33 V

JESD-30 Code:

O-LELF-R2

JESD-609 Code:

e3

Maximum Non Repetitive Peak Forward Current:

25 A

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Maximum Output Current:

1 A

Package Body Material:

GLASS

Package Shape:

Package Style (Meter):

LONG FORM

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

30 V

Sub-Category:

Rectifier Diodes

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

END

Trade Compliance

PRLL5818,115 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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