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PMZB300XN,315

NXP Semiconductors

PMZB300XN,315 by NXP Semiconductors

PMZB300XN,315 by NXP Semiconductors is an N-CHANNEL FET with 1A max drain current and 0.715W power dissipation. Ideal for applications requiring a single configuration, surface mount capability, and operating in enhancement mode up to 150°C.

Median Price

$0.119

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 230,000 parts In-Stock

1+ parts

-

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$0.119

1k+ parts

$0.099

10k+ parts

$0.088

230,000

-

$0.119

$0.099

$0.088

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,206 parts In-Stock

1+ parts

$0.093

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3,206

$0.093

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Vyrian

USA . 8,926 parts In-Stock

1+ parts

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8,926

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Anansix

USA . 2,700 parts In-Stock

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2,700

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,069 parts In-Stock

1+ parts

$0.088

100+ parts

-

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2,069

$0.088

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AZTECH Wire

Italy . 172 parts In-Stock

1+ parts

$13.490

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172

$13.490

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Continental Prestige Electronics

USA . 230,000 parts In-Stock

1+ parts

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$0.117

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230,000

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$0.117

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UNI Independent Distributors

Spain . 5,628 parts In-Stock

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5,628

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Overview

Unleash the power of innovation with the PMZB300XN,315 by NXP Semiconductors. This N-CHANNEL Power Field Effect Transistor offers unparalleled performance and reliability in a compact, single configuration that is perfect for a wide range of applications. With its cutting-edge METAL-OXIDE SEMICONDUCTOR technology, this enhancement mode transistor can handle up to 1A of drain current and 0.715W of power dissipation, making it ideal for demanding environments. Trust NXP Semiconductors to deliver top-quality components that exceed expectations. Elevate your projects with the PMZB300XN,315 - the smart choice for superior results.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used in high power applications due to their ability to handle higher current and voltage levels compared to P-CHANNEL FETs.

Configuration: SINGLE

Single configuration FETs simplify the circuit design and are suitable for applications where only one channel is required.

Surface Mount: YES

Surface mount packaging makes the FETs suitable for automated assembly processes, saving time and reducing costs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to integrate into circuits and offer better control over the switching behavior.

Maximum Drain Current (Abs) (ID): 1 A

The ability to handle a maximum drain current of 1 A makes this FET suitable for low to medium power applications.

Maximum Power Dissipation (Abs): 0.715 W

With a maximum power dissipation of 0.715 W, this FET can operate efficiently without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high switching speeds and low power consumption, making the FET energy efficient.

Maximum Operating Temperature: 150 °C

The FET can operate effectively at temperatures up to 150°C, making it suitable for a wide range of operating environments.

Terminal Finish: TIN

Tin terminal finish provides good electrical conductivity and solderability, ensuring reliable connections in the circuit.

Maximum Time At Peak Reflow Temperature (s): 30

The FET can withstand peak reflow temperatures for up to 30 seconds, making it suitable for reflow soldering processes.

Peak Reflow Temperature °C: 260

The FET can endure peak reflow temperatures of 260°C, ensuring proper soldering and robustness during assembly.

Technical Specifications

Power Field Effect Transistors (FET) PMZB300XN,315 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

1 A

Maximum Drain Current (ID):

1 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

PMZB300XN,315 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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