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PMZ290UNYL

NXP Semiconductors

PMZ290UNYL by NXP Semiconductors

PMZ290UNYL by NXP Semiconductors is an N-channel enhancement mode FET ideal for power management applications. It supports a max drain current of 1 A, power dissipation of 2.7 W, and operates up to 150 °C. Its surface mount design enhances versatility in circuit integration.

Median Price

$0.106

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 19,000 parts In-Stock

1+ parts

-

100+ parts

$0.106

1k+ parts

$0.088

10k+ parts

$0.078

19,000

-

$0.106

$0.088

$0.078

Distributors (In-Stock)

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Digiode

USA . 811 parts In-Stock

1+ parts

$0.083

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-

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811

$0.083

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Chip Stock

USA . 120,000 parts In-Stock

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120,000

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Vyrian

USA . 3,317 parts In-Stock

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3,317

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Anansix

USA . 1,868 parts In-Stock

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1,868

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,220 parts In-Stock

1+ parts

$0.078

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4,220

$0.078

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AZTECH Wire

Italy . 742 parts In-Stock

1+ parts

$17.510

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742

$17.510

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QUARKTWIN TECHNOLOGY LTD

USA . 9,459 parts In-Stock

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9,459

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UNI Independent Distributors

Spain . 5,323 parts In-Stock

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5,323

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Microchip USA

USA . 3,894 parts In-Stock

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3,894

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Perfect Parts

USA . 1,120 parts In-Stock

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Overview

Unlock superior performance with the PMZ290UNYL from NXP Semiconductors, a leader in innovative electronics. This N-channel power FET guarantees efficient energy management and robust reliability, perfect for today’s demanding applications. With its compact design and high endurance, it enhances your projects while reducing thermal concerns. Trust NXP to deliver quality and efficiency, driving your success in every application, from power supplies to motor control.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher efficiency, making them ideal for various applications, including switching and amplification.

Configuration: SINGLE

A single configuration streamlines usage in designs, allowing for simpler layouts and reducing overall board space.

Surface Mount: YES

Surface mount packaging enables more compact designs and better automation in assembly processes, which is beneficial for high-volume manufacturing.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs provide better control of the channel, ensuring minimal leakage currents in the off state and improved device performance.

Maximum Drain Current (Abs) (ID): 1 A

With a maximum drain current of 1 A, this FET can comfortably handle a variety of load requirements in portable and power applications.

Maximum Power Dissipation (Abs): 2.7 W

A maximum power dissipation of 2.7 W allows the FET to operate reliably without overheating, contributing to a longer device life and consistent performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables fast switching speeds and high input impedance, making this FET suitable for diverse electronic applications and enhancing overall circuit performance.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature of 150 °C provides flexibility in various environmental conditions, making the FET suitable for demanding applications.

Technical Specifications

Power Field Effect Transistors (FET) PMZ290UNYL attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

1 A

Maximum Drain Current (ID):

1 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

PMZ290UNYL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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