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PMR290UNE,115

NXP Semiconductors

PMR290UNE,115 by NXP Semiconductors

PMR290UNE,115 by NXP Semiconductors is an N-channel enhancement mode FET ideal for power management applications. It supports a max drain current of 0.7 A and operates up to 150 °C, ensuring reliability in demanding environments. Its surface mount design simplifies integration into compact circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 4,939 parts In-Stock

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Digiode

USA . 4,142 parts In-Stock

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Anansix

USA . 2,544 parts In-Stock

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Prism Electronics

USA . 1,178 parts In-Stock

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AZTECH Wire

Italy . 1,061 parts In-Stock

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$15.130

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One Stop Electronics

USA . 323 parts In-Stock

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$40.050

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A-Z Elektronik GmbH

Germany . 11,126 parts In-Stock

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UNI Independent Distributors

Spain . 5,813 parts In-Stock

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Corphita

USA . 4,108 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,646 parts In-Stock

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Perfect Parts

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Overview

Unlock unparalleled performance and efficiency with the PMR290UNE,115 from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP delivers this N-channel power FET designed for diverse applications, ensuring reliability even in demanding environments. With its compact surface mount design and robust capabilities, this transistor boosts your projects’ potential, making it an essential choice for engineers seeking superior performance and durability.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer lower on-resistance and higher electron mobility, making them ideal for high-speed and efficient switching applications.

Configuration: SINGLE

Single configuration allows for compact circuit designs, making this FET suitable for space-constrained applications.

Surface Mount: YES

Surface mount technology enables automated assembly processes, reducing manufacturing costs and improving reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs can be turned off and offer better performance in digital switching applications, providing flexibility in circuit design.

Maximum Drain Current (Abs) (ID): 0.7 A

With a maximum drain current of 0.7 A, this FET can handle moderate loads, making it suitable for various applications including low power switching.

Maximum Power Dissipation (Abs): 0.77 W

A maximum power dissipation of 0.77 W enables reliable operation under various conditions, enhancing thermal management in circuit designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology allows for high input impedance and low power consumption, ideal for battery-operated devices and efficient power management.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature ensures reliability in demanding environments and extends the range of applications for this FET.

Terminal Finish: TIN

Tin plating enhances solderability and ensures good electrical connections, which is essential for consistent performance in electronic circuits.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds during manufacturing allows for efficient soldering processes without sacrificing component integrity.

Peak Reflow Temperature °C: 260

Capable of withstanding a peak reflow temperature of 260 °C, this FET is suitable for high-temperature solder processes, ensuring durability in assembly.

Technical Specifications

Power Field Effect Transistors (FET) PMR290UNE,115 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

.7 A

Maximum Drain Current (ID):

.7 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

PMR290UNE,115 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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