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PHN210-TAPE-13

NXP Semiconductors

PHN210-TAPE-13 by NXP Semiconductors

PHN210-TAPE-13 by NXP Semiconductors is an N-channel FET designed for efficient switching applications. It features a max drain current of 3.5 A, a breakdown voltage of 30 V, and operates at up to 150 °C. Its compact surface mount design ensures versatility in various electronic circuits.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Digiode

USA . 4,795 parts In-Stock

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Anansix

USA . 2,129 parts In-Stock

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Vyrian

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One Stop Electronics

USA . 1,481 parts In-Stock

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Corphita

USA . 4,965 parts In-Stock

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UNI Independent Distributors

Spain . 2,858 parts In-Stock

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Overview

Unlock unmatched efficiency in your designs with the PHN210-TAPE-13 from NXP Semiconductors! This high-quality N-channel power FET is engineered for seamless switching applications, ensuring superior performance and reliability. Boasting a robust construction and impressive thermal capabilities, it empowers your projects with enhanced power management. Trust NXP's legacy of innovation and elevate your creations with a transistor that truly delivers value and dependability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a lightweight and durable package, ensuring reliability in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher electron mobility, making them suitable for efficient power control.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

The configuration allows for versatile applications with integrated protection, enhancing circuit reliability.

Transistor Application: SWITCHING

Optimized for switching applications, this FET enables fast operation, ideal for digital circuits and power management.

Surface Mount: YES

Surface mount technology provides a compact solution for modern circuit designs, facilitating automated assembly.

Minimum DS Breakdown Voltage: 30 V

A minimum breakdown voltage of 30V enhances safety and stability in high-voltage applications.

Package Shape: RECTANGULAR

The rectangular package shape is designed for efficient use of PCB space, allowing for better layout flexibility.

Terminal Form: GULL WING

Gull wing terminals support excellent solderability and thermal performance, ensuring reliable connections in assemblies.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption and improved efficiency in device performance.

No. of Elements: 2

Having two elements allows for simultaneous control in applications, increasing design versatility and efficiency.

Maximum Pulsed Drain Current (IDM): 14 A

With a pulsed drain current rating of 14A, this FET can handle significant current loads, making it suitable for high-power applications.

No. of Terminals: 8

An 8-terminal configuration provides ample connectivity options for integration into complex circuits.

Package Style (Meter): SMALL OUTLINE

Small outline package style minimizes space usage while providing sufficient thermal performance for the device.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology ensures fast switching speeds and high efficiency, essential for modern electronic applications.

Maximum Power Dissipation Ambient: 4 W

A maximum power dissipation of 4W enables effective thermal management in circuit designs, improving overall system reliability.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures reliability and functionality in demanding thermal environments.

Transistor Element Material: SILICON

Silicon as the semiconductor material offers good thermal stability and performance in varied electrical conditions.

Maximum Turn On Time (ton): 40 ns

A fast turn-on time of 40 ns enables high-speed switching, making this FET ideal for dynamic applications.

Maximum Turn Off Time (toff): 140 ns

The quick turn-off time of 140 ns supports efficient control in pulse modulation applications.

Maximum Drain Current (ID): 3.5 A

With a maximum drain current of 3.5 A, this FET can efficiently drive loads in various applications.

Maximum Drain-Source On Resistance: 0.1 ohm

A low on-resistance of 0.1 ohm translates to reduced power losses, contributing to overall efficiency.

Terminal Position: DUAL

Dual terminal positioning allows for flexible layout designs, simplifying PCB routing and enhancing performance.

Technical Specifications

Power Field Effect Transistors (FET) PHN210-TAPE-13 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

3.5 A

Maximum Drain-Source On Resistance:

.1 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

4 W

Maximum Pulsed Drain Current (IDM):

14 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

140 ns

Maximum Turn On Time (ton):

40 ns

Trade Compliance

PHN210-TAPE-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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