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PCKEP14PW,112

NXP Semiconductors

PCKEP14PW,112 by NXP Semiconductors

LOW SKEW CLOCK DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,138 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,138

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Anansix

USA . 2,037 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,037

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Digiode

USA . 533 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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533

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 732 parts In-Stock

1+ parts

$18.540

100+ parts

-

1k+ parts

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10k+ parts

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732

$18.540

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One Stop Electronics

USA . 206 parts In-Stock

1+ parts

$19.000

100+ parts

-

1k+ parts

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10k+ parts

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206

$19.000

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Andel Nordic

Denmark . 1,115 parts In-Stock

1+ parts

$25.820

100+ parts

-

1k+ parts

$18.076

10k+ parts

$18.076

1,115

$25.820

-

$18.076

$18.076

Microchip USA

USA . 302 parts In-Stock

1+ parts

$44.404

100+ parts

-

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302

$44.404

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UNI Independent Distributors

Spain . 2,752 parts In-Stock

1+ parts

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2,752

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Corphita

USA . 994 parts In-Stock

1+ parts

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994

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Technical Specifications

Clock Drivers & Buffers PCKEP14PW,112 attributes and parameters. Explore more Clock Drivers & Buffers devices from NXP Semiconductors

Specs

Additional Features:

NECL MODE: VEE = -2.375 V TO -3.8 V WITH VCC = 0 V

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

-2.5/-3.3/2.5/3.3

Propagation Delay At Nominal Supply:

.525 ns

Propagation Delay (tpd):

.475 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.025 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

PCKEP14PW,112 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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