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PCF8584T/2

NXP Semiconductors

PCF8584T/2 by NXP Semiconductors

BUS CONTROLLER, I2C; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$4.507

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 371 parts In-Stock

1+ parts

$4.507

100+ parts

$4.733

1k+ parts

$4.462

10k+ parts

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371

$4.507

$4.733

$4.462

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First Choice Components Inc.

USA . 6,395 parts In-Stock

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Bristol Electronics

USA . 4,691 parts In-Stock

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Flip Electronics

USA . 3,925 parts In-Stock

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Atlantic Semiconductor

USA . 3,420 parts In-Stock

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Dan-Mar Components

USA . 3,271 parts In-Stock

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Vyrian

USA . 3,010 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,332 parts In-Stock

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R&J Components

USA . 1,816 parts In-Stock

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Anansix

USA . 1,729 parts In-Stock

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Zilex Electronics Inc.

Canada . 1,260 parts In-Stock

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ECAB

Sweden . 1,044 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 900 parts In-Stock

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J2 Sourcing AB

Sweden . 532 parts In-Stock

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Component Sense

UK . 400 parts In-Stock

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Digiode

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Freddi Giovanni

Italy . 115 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 528 parts In-Stock

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$7.000

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$7.000

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Corohmni

South Africa . 4,894 parts In-Stock

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$50.180

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Perfect Parts

USA . 16,341 parts In-Stock

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 5,919 parts In-Stock

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Corphita

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Cyclops Electronics Ltd (Excess)

UK . 2,860 parts In-Stock

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Assy Fe

Spain . 1,799 parts In-Stock

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Kepictronics

USA . 1,491 parts In-Stock

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UNI Independent Distributors

Spain . 1,057 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Technical Specifications

Bus Controllers PCF8584T/2 attributes and parameters. Explore more Bus Controllers devices from NXP Semiconductors

Specs

Address Bus Width:

1

Bus Compatibility:

8051; 8049; 8048; 68000; 6800; 8088; Z80

Maximum Clock Frequency:

12 MHz

External Data Bus Width:

8

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

PCF8584T/2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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