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PCF8583TD-T

NXP Semiconductors

PCF8583TD-T by NXP Semiconductors

NXP Semiconductors' PCF8583TD-T is a CMOS timer/real-time clock IC with I2C interface, 8-bit RAM, and interrupt capability. It operates b/w -40 to 85°C, with supply voltage range of 2.5-6V. Ideal for applications requiring precise timekeeping in industrial settings.

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Lifecycle Status

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8

In-Stock Inventory

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Ashlea Components Ltd

UK . 2,000 parts In-Stock

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Vyrian

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Digiode

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Florida Circuit

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Inland Empire Components Inc.

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Nova Conductors

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LIBRA Elektronik GmbH

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Ampacity Inc.

Singapore . 1,600 parts In-Stock

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AZTECH Wire

Italy . 630 parts In-Stock

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One Stop Electronics

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Aztec Data Supply Inc.

USA . 4,902 parts In-Stock

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Corohmni

South Africa . 4,960 parts In-Stock

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UNI Independent Distributors

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Corphita

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Argo Parts USA

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Continental Prestige Electronics

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Bastille Electronics

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Overview

Enhance your electronic projects with the PCF8583TD-T by NXP Semiconductors, a leader in innovative semiconductor solutions. As part of the Timers & Real-Time Clocks category, this product offers precise timekeeping and timer functions for a wide range of applications. With its high-quality construction and reliable performance, customers can trust in the value and benefits that this product brings to their designs. Say goodbye to inaccurate timekeeping and hello to seamless operation with the PCF8583TD-T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to external elements, making it suitable for various industrial applications.

Information Access Method: I2C

I2C interface allows for easy communication with other devices and systems, enabling seamless integration and control.

Surface Mount: YES

Surface mount design saves space and simplifies installation, ideal for compact and efficient electronic designs.

Maximum Supply Voltage: 6 V

Support for a maximum supply voltage of 6V ensures compatibility with a wide range of power sources and applications.

Interrupt Capability: Y

Interrupt capability allows for real-time response to events and signals, enhancing the timing precision and accuracy of the device.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in harsh environments and industrial settings.

Peripheral IC Type: TIMER, REAL TIME CLOCK

Combination of timer and real-time clock functionality provides versatile timekeeping and scheduling capabilities for diverse applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the device efficient and reliable for long-term operation.

Technical Specifications

Timers & Real-Time Clocks PCF8583TD-T attributes and parameters. Explore more Timers & Real-Time Clocks devices from NXP Semiconductors

Specs

Maximum Clock Frequency:

.032 MHz

Information Access Method:

I2C

Interrupt Capability:

Y

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

7.55 mm

No. of Terminals:

8

No. of Timers:

0

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Words:

256

Maximum Seated Height:

2.65 mm

Sub-Category:

Timer or RTC

Maximum Supply Current:

.2 mA

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Minimum Time:

1/100 SECOND

Volatile:

YES

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

PCF8583TD-T Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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