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PCF8583P/F5,112

NXP Semiconductors

PCF8583P/F5,112 by NXP Semiconductors

NXP Semiconductors' PCF8583P/F5,112 is a CMOS timer/real-time clock IC with I2C interface. It operates b/w -40 to 85°C, has 256 RAM words, and supports interrupt capability. Widely used in industrial applications for timekeeping due to its low power consumption of 0.2 mA at max supply voltage of 6V.

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Vyrian

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Nova Conductors

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LIBRA Elektronik GmbH

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Ampacity Inc.

Singapore . 368 parts In-Stock

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AZTECH Wire

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One Stop Electronics

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Advanced Electronics

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Corohmni

South Africa . 662 parts In-Stock

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Overview

Upgrade your devices with the NXP Semiconductors PCF8583P/F5,112 Timers & Real-Time Clocks. With a focus on quality and reliability, NXP Semiconductors offers cutting-edge technology that ensures precise timekeeping and uninterrupted performance. Ideal for a wide range of applications, this product provides customers with value, efficiency, and peace of mind. Say goodbye to timing issues and hello to seamless operations with the PCF8583P/F5,112 by NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Information Access Method: I2C

The I2C communication protocol allows for easy interfacing with other microcontrollers or devices, making it versatile and compatible with a wide range of systems.

Maximum Supply Voltage: 6 V

The higher maximum supply voltage allows for flexibility in powering the device within a safe range.

On Chip Data RAM Width: 8

The 8-bit data RAM width allows for efficient storage and processing of data on the chip.

Interrupt Capability: Y

The interrupt capability enables the device to respond to external events promptly, enhancing its real-time clock functionality.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature ensures reliable performance even in extreme cold environments.

Maximum Seated Height: 4.2 mm

The low seated height makes the product suitable for compact electronic designs where space is limited.

RAM Words: 256

The 256 RAM words provide ample memory for storing data and settings, allowing for versatile applications.

Maximum Time At Peak Reflow Temperature (s): 40

The ability to withstand the peak reflow temperature for 40 seconds ensures reliable soldering during manufacturing processes.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Timers & Real-Time Clocks PCF8583P/F5,112 attributes and parameters. Explore more Timers & Real-Time Clocks devices from NXP Semiconductors

Specs

Maximum Clock Frequency:

.1 MHz

Information Access Method:

I2C

Interrupt Capability:

Y

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e4

Length:

9.5 mm

No. of Terminals:

8

No. of Timers:

0

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Words:

256

Maximum Seated Height:

4.2 mm

Sub-Category:

Timer or RTC

Maximum Supply Current:

.2 mA

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Minimum Time:

1/100 SECOND

Maximum Time At Peak Reflow Temperature (s):

40

Volatile:

YES

Width:

7.62 mm

Peripheral IC Type:

Trade Compliance

PCF8583P/F5,112 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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