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PCF8564AUG/12HB/1V

NXP Semiconductors

PCF8564AUG/12HB/1V by NXP Semiconductors

PCF8564AUG/12HB/1V by NXP is a CMOS real-time clock with I2C access, operating b/w 1.8V and 5.5V. It features a max temp of 85 °C, 9 terminals in a no-lead package, ideal for industrial applications requiring precise timing.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,778 parts In-Stock

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Anansix

USA . 2,827 parts In-Stock

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Digiode

USA . 2,460 parts In-Stock

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2,460

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Microchip USA

USA . 8,888 parts In-Stock

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$3.463

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$3.463

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AZTECH Wire

Italy . 510 parts In-Stock

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$16.740

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510

$16.740

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Corohmni

South Africa . 866 parts In-Stock

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$31.986

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866

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One Stop Electronics

USA . 1,328 parts In-Stock

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$33.000

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$33.000

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UNI Independent Distributors

Spain . 7,378 parts In-Stock

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Corphita

USA . 643 parts In-Stock

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Vigor

Singapore . 160 parts In-Stock

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Overview

Unlock precision timing and reliable performance with the PCF8564AUG/12HB/1V from NXP Semiconductors. This advanced real-time clock enhances your designs with its robust functionality, ideal for industrial applications demanding accuracy under varying conditions. Enjoy seamless integration via I2C and benefit from NXP's trusted quality and innovation. Elevate your projects with a component designed for durability, efficiency, and exceptional reliability—ensuring your success today and tomorrow!

Feature Benefit Bullets

Information Access Method: I2C

I2C interface allows for easy integration with microcontrollers and other devices, minimizing wiring complexity and enabling multi-device communication.

Surface Mount: YES

Surface mount technology ensures a compact design, facilitating space-saving in circuit boards, making it an ideal choice for modern electronic applications.

Maximum Supply Voltage: 5.5 V

The wide maximum supply voltage allows for flexible integration into various systems that may operate at different voltage levels.

Package Shape: RECTANGULAR

The rectangular package shape offers a standardized footprint, ensuring compatibility with existing circuit layouts.

No. of Terminals: 9

A sufficient number of terminals enables a variety of functions while keeping the design manageable and efficient.

Package Style (Meter): UNCASED CHIP

An uncased chip style makes it lighter and potentially lower in cost, while also allowing for custom packaging solutions in specific applications.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage ensures energy efficiency, making the product suitable for battery-powered and low-power applications.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C signifies reliability and performance even in moderately high-temperature environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is designed to perform in harsh environmental conditions, suitable for industrial use.

Terminal Position: UPPER

Upper terminal positioning can simplify PCB design and assembly, improving accessibility for connections.

Maximum Clock Frequency: 0.032 MHz

This low maximum clock frequency is suitable for applications that do not require high-speed operation, which can help in design simplification and lower power consumption.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C indicates compatibility with modern soldering techniques, promoting ease of assembly in various manufacturing environments.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures robustness and reliability in demanding applications, making it suitable for a wide range of environments.

Peripheral IC Type: TIMER, REAL TIME CLOCK

As a dedicated timer and real-time clock IC, it ensures precise timekeeping functionalities, an essential feature for many applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it a great choice for portable and battery-operated devices.

Terminal Form: NO LEAD

No-lead terminals facilitate a lower profile design, promoting reduced PCB space usage and enhancing overall circuit design flexibility.

Nominal Supply Voltage: 2 V

A nominal supply voltage of 2 V optimizes power efficiency, contributing to longer battery life in portable devices.

Technical Specifications

Timers & Real-Time Clocks PCF8564AUG/12HB/1V attributes and parameters. Explore more Timers & Real-Time Clocks devices from NXP Semiconductors

Specs

Maximum Clock Frequency:

.032 MHz

Information Access Method:

I2C

JESD-30 Code:

R-XUUC-N9

No. of Terminals:

9

No. of Timers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

260

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Peripheral IC Type:

Trade Compliance

PCF8564AUG/12HB/1V Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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