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PCF2111PN

NXP Semiconductors

PCF2111PN by NXP Semiconductors

LIQUID CRYSTAL DISPLAY DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 40; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,981 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,981

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-

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Anansix

USA . 2,833 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,833

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Digiode

USA . 2,709 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,709

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,281 parts In-Stock

1+ parts

$40.500

100+ parts

-

1k+ parts

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10k+ parts

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1,281

$40.500

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UNI Independent Distributors

Spain . 4,235 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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4,235

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Corphita

USA . 1,116 parts In-Stock

1+ parts

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100+ parts

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1,116

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Technical Specifications

Graphics Display Drivers PCF2111PN attributes and parameters. Explore more Graphics Display Drivers devices from NXP Semiconductors

Specs

Data Input Mode:

SERIAL

Display Mode:

DOT MATRIX

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

R-PDIP-T40

Multiplexed Display Capability:

YES

No. of Functions:

1

No. of Segments:

32

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Maximum Supply Current:

.05 mA

Maximum Supply Voltage:

6.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

PCF2111PN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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