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PCA9922PW,112

NXP Semiconductors

PCA9922PW,112 by NXP Semiconductors

PCA9922PW,112 from NXP Semiconductors is a segment display driver with a 5V nominal supply and operates in temperatures from -40 °C to 85 °C. It features serial data input and supports up to 8 segments. Ideal for compact graphics applications, it comes in a thin profile package.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

USA . 8,751 parts In-Stock

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Anansix

USA . 521 parts In-Stock

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Digiode

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490

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Microchip USA

USA . 142 parts In-Stock

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$0.956

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Component Stockers USA

USA . 3,688 parts In-Stock

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$8.230

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AZTECH Wire

Italy . 582 parts In-Stock

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One Stop Electronics

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UNI Independent Distributors

Spain . 7,388 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,313 parts In-Stock

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Corphita

USA . 4,942 parts In-Stock

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Overview

Elevate your display solutions with the PCA9922PW,112 from NXP Semiconductors, a trusted leader in innovative electronics. This high-quality graphics display driver seamlessly integrates into diverse applications, offering reliability and performance you can count on. Enjoy the benefits of efficient power management and robust design for environments with varying temperatures. Choose NXP for unparalleled quality and reap the rewards of cutting-edge technology that enhances your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures robust performance and longevity in various applications.

Display Mode: SEGMENT

Segment display mode allows for clear and precise visual representation of information, making it suitable for various display needs.

Data Input Mode: SERIAL

The serial data input mode simplifies integration and communication with microcontrollers, enhancing versatility in design.

Surface Mount: YES

Surface mount technology reduces PCB space requirements and supports automated assembly processes, leading to cost-effective manufacturing.

Maximum Supply Voltage: 5.5 V

Allows compatibility with a wide range of power sources while ensuring safe operating conditions.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient PCB layout and design flexibility.

Power Supplies (V): 5

Standardized 5V power supply ensures easy integration with common electronic systems.

No. of Terminals: 16

The 16 terminals provide sufficient connectivity for diverse functionalities and easier circuit integration.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact package style enables high-density circuit board designs and saves space in smaller devices.

Minimum Supply Voltage: 3.3 V

Supports low-voltage applications, making it suitable for energy-efficient designs.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this component is ideal for extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish ensures excellent conductivity and resistance to corrosion, enhancing longevity and reliability.

Terminal Position: DUAL

Dual terminal positioning supports effective heat dissipation and mounting flexibility.

Maximum Seated Height: 1.1 mm

The low seated height allows for better fitting in compact designs and improves overall aesthetics.

Width: 4.4 mm

A narrow width enables dense layouts and compatibility with compact devices.

Maximum Time At Peak Reflow Temperature: 30 s

The specified maximum reflow time ensures compatibility with modern soldering techniques for efficient manufacturing.

Peak Reflow Temperature: 260 C

The high peak reflow temperature supports advanced soldering processes, ensuring reliable assembly.

Length: 5 mm

The compact length allows for space-saving configurations on circuit boards.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, guaranteeing performance under rigorous conditions.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and reliability in assembly processes.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with a variety of electronic systems in common applications.

No. of Segments: 8

The 8 segments facilitate versatile display functionalities, suitable for various applications.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm enables fine-pitch design on circuit boards, enhancing integration capability.

Minimum fmax: 25 MHz

The minimum frequency of 25 MHz supports high-speed data processing, making it ideal for responsive applications.

Technical Specifications

Graphics Display Drivers PCA9922PW,112 attributes and parameters. Explore more Graphics Display Drivers devices from NXP Semiconductors

Specs

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

8

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

25 MHz

Trade Compliance

PCA9922PW,112 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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