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PCA9629PW,118

NXP Semiconductors

PCA9629PW,118 by NXP Semiconductors

PCA9629PW,118 from NXP Semiconductors is a motion control IC designed for industrial applications. It operates at a nominal voltage of 5V, with a max temp of 85 °C and features a compact 16-terminal gull-wing package. Ideal for space-constrained environments, it supports surface mount technology.

Median Price

$1.198

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 571 parts In-Stock

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$1.116

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Rochester

USA . 221 parts In-Stock

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$1.280

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$1.060

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$0.947

221

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$1.280

$1.060

$0.947

Distributors (In-Stock)

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Digiode

USA . 2,465 parts In-Stock

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$0.998

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Vyrian

USA . 8,146 parts In-Stock

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Anansix

USA . 1,169 parts In-Stock

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Contempo Components LLC

USA . 65 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,096 parts In-Stock

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$0.945

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$0.945

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Vigor

Singapore . 607 parts In-Stock

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$1.010

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607

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Microchip USA

USA . 3,247 parts In-Stock

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$7.381

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Advanced Electronics

New Zealand . 822 parts In-Stock

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$16.835

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$16.666

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$15.993

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822

$16.835

$16.666

$15.993

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AZTECH Wire

Italy . 1,173 parts In-Stock

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$21.610

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QUARKTWIN TECHNOLOGY LTD

USA . 26,440 parts In-Stock

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UNI Independent Distributors

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Overview

Unlock the potential of your designs with the PCA9629PW,118 from NXP Semiconductors! This top-tier Motion Control IC delivers exceptional performance in a compact form factor, ideal for demanding applications in industrial automation and robotics. With NXP's renowned quality and reliability, you can trust that this solution will enhance efficiency while minimizing power consumption. Elevate your projects with cutting-edge technology designed for success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material enhances the overall reliability and longevity of the IC, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a more compact design and easier integration into automated assembly processes, saving space on printed circuit boards.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient space utilization on PCBs, making it easier to align and solder multiple components.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard 5V supply makes the IC compatible with a wide range of devices and systems, ensuring broad application potential.

Power Supplies (V): 5

Designed for a 5V power supply, this IC integrates seamlessly with other 5V powered components, enhancing system compatibility.

No. of Terminals: 16

Having 16 terminals allows for comprehensive functionality and connectivity options, catering to complex applications in motion control.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact profile maximizes the efficiency of space on PCB, allowing for more components to fit in a smaller area without sacrificing performance.

Maximum Operating Temperature: 85 °C

With an operating temperature of up to 85 °C, this product is suitable for industrial environments where temperature fluctuations can occur.

Minimum Operating Temperature: -40 °C

The ability to function in extreme low temperatures (-40 °C) ensures reliable performance in outdoor and harsh environmental applications.

Terminal Position: DUAL

Dual terminal positioning aids in easy integration onto PCBs, facilitating a simpler assembly process and reducing the risk of errors.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds allows for efficient soldering processes while minimizing potential thermal damage to sensitive components.

Peak Reflow Temperature °C: 260

Withstanding peak reflow temperatures of 260 °C ensures durability during soldering, making it compatible with modern assembly techniques.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates robustness and reliability in challenging conditions, perfect for industrial automation applications.

Maximum Supply Current (Isup): 10 mA

A maximum supply current of 10 mA allows for low power consumption, making it ideal for energy-sensitive applications and extending battery life.

Terminal Form: GULL WING

Gull wing terminal form is designed for reliable solder joints, ensuring solid mechanical and electrical connections on surface mount PCBs.

Terminal Pitch: 0.635 mm

With a terminal pitch of 0.635 mm, this IC facilitates high-density designs, enabling efficient layout and routing options for intricate circuits.

Technical Specifications

Motion Control ICs PCA9629PW,118 attributes and parameters. Explore more Motion Control ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G16

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

10 mA

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

PCA9629PW,118 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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