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PCA85176T/Q900/1,1

NXP Semiconductors

PCA85176T/Q900/1,1 by NXP Semiconductors

The PCA85176T/Q900/1 by NXP Semiconductors is a CMOS graphics display driver designed for segment displays. It operates within a supply voltage range of 1.8V to 5.5V, supports up to 16 digits, and features AEC-Q100 screening for industrial applications. With a compact design and multiplexed capability, it's ideal for automotive and consumer electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,501 parts In-Stock

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Digiode

USA . 2,671 parts In-Stock

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Anansix

USA . 1,397 parts In-Stock

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Vigor

Singapore . 81 parts In-Stock

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$2.020

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AZTECH Wire

Italy . 878 parts In-Stock

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One Stop Electronics

USA . 638 parts In-Stock

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$46.500

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QUARKTWIN TECHNOLOGY LTD

USA . 9,348 parts In-Stock

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Microchip USA

USA . 2,898 parts In-Stock

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UNI Independent Distributors

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Corphita

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Overview

Elevate your display solutions with the PCA85176T/Q900/1,1 from NXP Semiconductors—a leader in high-quality electronics. This advanced graphics display driver combines superior performance and reliability, making it ideal for both industrial and consumer applications. With its compact design, low power requirements, and robust temperature range, it seamlessly enhances user experiences while ensuring longevity. Trust in NXP’s commitment to quality and innovation for your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures robustness, making this display driver suitable for a variety of applications.

Display Mode: SEGMENT

The segment display mode allows for clear and effective visual representation, ideal for devices that require easy readability.

Data Input Mode: SERIAL

The serial data input mode simplifies integration with microcontrollers and other digital devices, enhancing compatibility.

Surface Mount: YES

Surface mount technology enables compact design and saves space on printed circuit boards, which is advantageous for space-constrained applications.

Maximum Supply Voltage: 5.5 V

This high threshold allows the driver to operate reliably within various voltage systems, providing versatility.

Screening Level: AEC-Q100

This certification guarantees high reliability and suitability for automotive applications, ensuring quality performance in critical environments.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient spacing and layout on PCBs, allowing for better design flexibility.

Power Supplies (V): 2/5

The dual power supply requirement means it's adaptable to different system voltages, increasing usability across various applications.

No. of Terminals: 56

A higher number of terminals allows for extensive connectivity options, facilitating complex display designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small and thin package style is perfect for modern compact electronic devices which demand minimal footprint.

No. of Backplanes: 4-BP

Having multiple backplanes enhances display multiplexing capabilities, providing richer visual outputs.

Minimum Supply Voltage: 1.8 V

With a low minimum supply voltage, this driver is power-efficient, which is crucial for battery-operated devices.

Maximum Operating Temperature: 95 °C

The high maximum temperature rating ensures reliable performance even in demanding thermal conditions.

Minimum Operating Temperature: -40 °C

Operating in extremely low temperatures makes this driver suitable for harsh environments, such as outdoor applications.

Terminal Finish: MATTE TIN

Matte tin finishing improves solderability and reliability of connections, enhancing the product's overall lifespan.

Terminal Position: DUAL

Dual terminal positioning allows for flexible mounting options, making the driver easier to integrate into various designs.

Maximum Seated Height: 1.2 mm

The low seated height facilitates placement in slim devices, an essential feature for modern electronics.

Width: 6.1 mm

A narrow width permits high-density layout on PCBs, essential for compact device design.

Peak Reflow Temperature °C: 260

The ability to withstand high reflow temperatures indicates strong resistance to thermal stress during assembly.

Length: 14 mm

A moderate length provides an ideal balance between space optimization and functional connectivity.

Multiplexed Display Capability: YES

Support for multiplexed displays allows for more efficient use of segments, reducing power consumption during operation.

Temperature Grade: INDUSTRIAL

Designed for industrial settings, this temperature grade ensures the driver can handle tough environments reliably.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation, making this driver efficient and effective.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and assembly, enhancing manufacturing efficiency.

Maximum Supply Current: 0.02 mA

The low maximum supply current indicates energy efficiency, benefiting battery-powered applications.

No. of Digits/Characters: 16-DIGIT

Supporting up to 16 digits or characters allows for versatile display options in a variety of applications.

No. of Segments: 40

Having 40 segments provides detailed and intricate display capabilities, enhancing visual output effectiveness.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch enables high-density layouts, ideal for miniaturized devices.

Minimum fmax: 0.4 MHz

A minimum frequency of 0.4 MHz ensures compatibility with a broad range of functionalities and applications.

Interface IC Type: LIQUID CRYSTAL DISPLAY DRIVER

As a dedicated LCD driver, this IC type is optimized for controlling LCDs, ensuring reliability in display performance.

Technical Specifications

Graphics Display Drivers PCA85176T/Q900/1,1 attributes and parameters. Explore more Graphics Display Drivers devices from NXP Semiconductors

Specs

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

1

Multiplexed Display Capability:

YES

No. of Backplanes:

4-BP

No. of Digits/Characters:

16-DIGIT

No. of Functions:

1

No. of Segments:

40

No. of Terminals:

56

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.02 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Minimum fmax:

.4 MHz

Trade Compliance

PCA85176T/Q900/1,1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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