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PCA2002CX8/12/1,00

NXP Semiconductors

PCA2002CX8/12/1,00 by NXP Semiconductors

PCA2002CX8/12/1,00 by NXP Semiconductors is a CMOS clock IC designed for commercial use. It operates b/w -10 °C and 60 °C with a power supply of 1.55V. Ideal for various applications, it features a durable plastic/epoxy package for reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,490 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,490

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-

-

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Digiode

USA . 959 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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959

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-

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Anansix

USA . 933 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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933

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,201 parts In-Stock

1+ parts

$17.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,201

$17.800

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UNI Independent Distributors

Spain . 5,700 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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5,700

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Corphita

USA . 4,263 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,263

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Overview

Experience precision timing like never before with the PCA2002CX8/12/1,00 from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP delivers a Clock IC designed to enhance your applications with unparalleled reliability and efficiency. Operating seamlessly across a wide temperature range, this CMOS technology solution is perfect for automotive, industrial, and consumer electronics. Elevate your projects, reduce downtime, and enjoy peace of mind with NXP’s trusted expertise.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures a robust design that can withstand environmental factors, making it suitable for various applications.

Power Supplies (V): 1.55

A low operating voltage of 1.55V enhances power efficiency, making the product ideal for battery-operated devices and reducing overall energy consumption.

Maximum Operating Temperature: 60 °C

With a maximum operating temperature of 60 °C, this IC can function reliably in standard commercial environments without risk of overheating.

Minimum Operating Temperature: -10 °C

The ability to operate down to -10 °C allows this IC to be used in a wider range of conditions, making it versatile for both indoor and outdoor applications.

Temperature Grade: COMMERCIAL

This device is graded for commercial use, ensuring it meets strict quality and performance standards suitable for general consumer electronics.

Technology: CMOS

The CMOS technology employed in this IC results in low power consumption and high integration capabilities, providing enhanced performance for modern electronic circuits.

Technical Specifications

Clock ICs PCA2002CX8/12/1,00 attributes and parameters. Explore more Clock ICs devices from NXP Semiconductors

Specs

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

DIE OR CHIP

Power Supplies (V):

1.55

Qualification:

Not Qualified

Sub-Category:

Clock ICs

Technology:

CMOS

Temperature Grade:

Trade Compliance

PCA2002CX8/12/1,00 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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