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NX5DV330DS,118

NXP Semiconductors

NX5DV330DS,118 by NXP Semiconductors

NXP Semiconductors' NX5DV330DS,118 is a 4-function multiplexer with 6ns propagation delay. Operating b/w -40 to 85°C, it has a supply voltage range of 4-5.5V and output polarity is TRUE. Ideal for industrial applications requiring compact size and high performance in surface-mount designs.

Median Price

$0.738

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 318,919 parts In-Stock

1+ parts

-

100+ parts

$0.738

1k+ parts

$0.612

10k+ parts

$0.546

318,919

-

$0.738

$0.612

$0.546

Verical

USA . 260,000 parts In-Stock

1+ parts

-

100+ parts

-

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$0.765

10k+ parts

$0.682

260,000

-

-

$0.765

$0.682

Mouser Electronics

USA . 2,488 parts In-Stock

1+ parts

-

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$0.471

2,488

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$0.471

Distributors (In-Stock)

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Digiode

USA . 1,377 parts In-Stock

1+ parts

$0.575

100+ parts

-

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1,377

$0.575

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Nova Conductors

Japan . 750 parts In-Stock

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$0.644

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750

$0.644

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Vyrian

USA . 160,578 parts In-Stock

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160,578

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Anansix

USA . 1,052 parts In-Stock

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1,052

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Distributors (Availability)

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Ampacity Inc.

Singapore . 193,405 parts In-Stock

1+ parts

$0.400

100+ parts

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193,405

$0.400

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Vigor

Singapore . 399,295 parts In-Stock

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$0.420

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399,295

$0.420

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Corphita

USA . 2,160 parts In-Stock

1+ parts

$0.544

100+ parts

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2,160

$0.544

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Netroflash

USA . 50 parts In-Stock

1+ parts

$0.644

100+ parts

$0.632

1k+ parts

$0.612

10k+ parts

$0.599

50

$0.644

$0.632

$0.612

$0.599

Microchip USA

USA . 350 parts In-Stock

1+ parts

$4.210

100+ parts

$4.210

1k+ parts

$4.210

10k+ parts

$4.210

350

$4.210

$4.210

$4.210

$4.210

QUARKTWIN TECHNOLOGY LTD

USA . 9,763 parts In-Stock

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9,763

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UNI Independent Distributors

Spain . 1,321 parts In-Stock

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1,321

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Perfect Parts

USA . 11 parts In-Stock

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Overview

Elevate your electronic designs with the NX5DV330DS,118 by NXP Semiconductors. This multiplexer & demultiplexer device boasts top-notch quality from a trusted manufacturer, offering 4 functions in a compact rectangular package. Perfect for industrial applications, this product provides a nominal supply voltage of 5V and fast propagation delay of 6ns. Experience seamless integration with its surface mount feature and dual terminal position. Enhance your projects with the reliability and efficiency that NXP Semiconductors delivers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the internal components, making the product reliable for long-term use.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and reducing production time.

No. of Functions: 4

Provides versatility and flexibility in signal routing and processing.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently within standard voltage levels, ensuring proper functionality.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components in a circuit, allowing for complex signal manipulation.

Propagation Delay (tpd): 6 ns

Low propagation delay ensures quick signal processing and minimal lag time.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Can withstand cold temperatures, making it suitable for a wide range of operating conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides excellent conductivity and corrosion resistance for reliable signal transmission.

Width: 3.9 mm

Compact size allows for efficient use of space on circuit boards.

Output Polarity: TRUE

Ensures correct signal polarity for accurate data transmission.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, suitable for demanding applications.

Maximum Supply Voltage (Vsup): 5.5 V

Allows for a slight margin above the nominal voltage, providing a safety buffer for voltage fluctuations.

No. of Outputs: 2

Provides multiple output options for signal routing and distribution.

Technical Specifications

Multiplexer & Demultiplexer NX5DV330DS,118 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

5DV

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

1

No. of Outputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR, 13 INCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.73 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NX5DV330DS,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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