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NX3P191UK

NXP Semiconductors

NX3P191UK by NXP Semiconductors

NX3P191UK by NXP Semiconductors is a compact SPST switch designed for industrial applications. It operates b/w 1.1V and 3.6V, with a max temp of 85 °C and features a very thin profile (0.54mm height). Ideal for space-constrained environments, it ensures reliable performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,450 parts In-Stock

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2,450

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Digiode

USA . 1,045 parts In-Stock

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1,045

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Anansix

USA . 307 parts In-Stock

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307

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Distributors (Availability)

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One Stop Electronics

USA . 788 parts In-Stock

1+ parts

$5.500

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788

$5.500

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Kepictronics

USA . 60,000 parts In-Stock

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60,000

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Assy Fe

Spain . 60,000 parts In-Stock

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60,000

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A-Z Elektronik GmbH

Germany . 7,500 parts In-Stock

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7,500

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ChipstoGo Electronic ltd

UK . 5,658 parts In-Stock

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5,658

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UNI Independent Distributors

Spain . 4,195 parts In-Stock

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4,195

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Corphita

USA . 1,669 parts In-Stock

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1,669

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Perfect Parts

USA . 13 parts In-Stock

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Overview

Unlock unparalleled performance with the NX3P191UK from NXP Semiconductors, a leader in innovative solutions. This ultra-thin multiplexer delivers exceptional reliability in extreme temperatures, making it ideal for industrial applications. Experience seamless integration and outstanding efficiency, ensuring your designs stand out. Trust NXP’s reputation for quality and innovation to enhance your projects and drive success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials provides durability and resistance to environmental factors, making the product suitable for various applications.

Surface Mount: YES

Being surface mount compatible allows for efficient PCB space utilization and supports automated assembly processes.

Package Shape: SQUARE

The square package shape allows for uniform placement on PCBs, facilitating better design flexibility and stability.

Nominal Supply Voltage (Vsup): 1.2 V

A low nominal supply voltage indicates low power consumption, making this product ideal for battery-powered devices and energy-sensitive applications.

No. of Terminals: 4

With 4 terminals, this product offers sufficient connectivity for simple switching applications, while maintaining a compact design.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

A very thin profile and fine pitch design enhances the integration density on the PCB, allowing for more compact electronic designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product is suitable for industrial applications where heat may be a factor.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this product ideal for harsh environments and applications exposed to extreme temperatures.

Terminal Position: BOTTOM

Bottom terminal positioning is advantageous for surface mounting and contributes to a lower profile in compact designs.

Maximum Seated Height: 0.54 mm

A low seated height enables space-saving designs, allowing for integration into thinner devices without compromising performance.

Width: 0.76 mm

A narrow width aids in compact layouts, making the product suitable for space-constrained applications.

Other IC type: SPST

SPST (Single Pole Single Throw) switching capability makes it versatile for basic on-off functionality in various applications.

Minimum Supply Voltage (Vsup): 1.1 V

Having a minimum supply voltage of 1.1 V ensures compatibility with a wide range of low-voltage systems and devices.

Length: 0.76 mm

A compact length maximizes the design efficiency and facilitates easy integration into space-restricted products.

Temperature Grade: INDUSTRIAL

Rated for industrial use, this product is designed to withstand more demanding operational conditions, ensuring reliability.

Terminal Form: BALL

Ball terminals provide reliable connections and enhance solderability, ensuring durable and secure mounting onto PCBs.

Terminal Pitch: 0.4 mm

A terminal pitch of 0.4 mm enables high-density layouts, supporting the development of compact electronic circuits.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V allows compatibility with a broad range of electronic components and power supplies.

Technical Specifications

Multiplexers & Switches NX3P191UK attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

S-PBGA-B4

Length:

.76 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

.54 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

1.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width (mm):

.76 mm

Trade Compliance

NX3P191UK Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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