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NX3P190UK

NXP Semiconductors

NX3P190UK by NXP Semiconductors

NX3P190UK by NXP Semiconductors is a compact SPST switch in a square grid array with 4 terminals. It features surface mount technology and is made from durable plastic/epoxy. Ideal for signal routing in various electronic applications, it ensures reliable performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,462 parts In-Stock

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Vyrian

USA . 2,193 parts In-Stock

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Anansix

USA . 1,288 parts In-Stock

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One Stop Electronics

USA . 695 parts In-Stock

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$2.500

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695

$2.500

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Assy Fe

Spain . 45,000 parts In-Stock

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45,000

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Kepictronics

USA . 42,000 parts In-Stock

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42,000

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UNI Independent Distributors

Spain . 4,423 parts In-Stock

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Corphita

USA . 3,149 parts In-Stock

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3,149

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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A-Z Elektronik GmbH

Germany . 2,408 parts In-Stock

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Infinite Electronics LLP (Excess)

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1,001

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Formix International (Excess)

India . 992 parts In-Stock

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992

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Perfect Parts

USA . 874 parts In-Stock

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874

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Futuretech Components

Singapore . 500 parts In-Stock

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500

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Overview

Elevate your designs with the NX3P190UK from NXP Semiconductors, a leader in innovative solutions. This high-quality multiplexer offers unparalleled reliability and versatility for a range of applications, ensuring seamless performance in your projects. With its compact, surface-mount design, the NX3P190UK enhances efficiency while saving space. Experience enhanced signal integrity and flexibility, making it the perfect choice for modern electronic systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors, making this product reliable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern electronic devices, making installation straightforward.

Package Shape: SQUARE

The square package shape optimizes space utilization on PCB layouts, allowing for efficient use of real estate in product designs.

No. of Terminals: 4

Having four terminals provides versatility in connections and simplifies the integration with other components in a circuit.

Package Style (Meter): GRID ARRAY

The grid array package style facilitates better thermal management and electrical performance, which is essential for high-performance applications.

Terminal Position: BOTTOM

Bottom terminal positioning allows for efficient board layout and can provide better signal integrity in densely populated circuit boards.

Other IC Type: SPST

As a Single Pole Single Throw (SPST) switch, this product is ideal for simple on/off applications, making it a low-cost and efficient option.

Terminal Form: BALL

Ball terminal form enhances soldering reliability and quality, ensuring a strong mechanical and electrical connection during assembly.

Technical Specifications

Multiplexers & Switches NX3P190UK attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

S-PBGA-B4

No. of Terminals:

4

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

BALL

Terminal Position:

BOTTOM

Trade Compliance

NX3P190UK Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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