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NE58633BS-G

NXP Semiconductors

NE58633BS-G by NXP Semiconductors

NE58633BS-G by NXP Semiconductors is a versatile audio amplifier with a compact chip carrier design. It operates at 1.2/1.5V, supports up to 11mA supply current, and functions in temperatures from 0 °C to 70 °C. Ideal for surface mount applications in audio and video systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,285 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,285

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Digiode

USA . 689 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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689

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Anansix

USA . 145 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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145

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,402 parts In-Stock

1+ parts

$11.800

100+ parts

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1k+ parts

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10k+ parts

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1,402

$11.800

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UNI Independent Distributors

Spain . 4,931 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,931

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Corphita

USA . 980 parts In-Stock

1+ parts

-

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1k+ parts

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980

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-

Overview

Elevate your audio experience with the NE58633BS-G from NXP Semiconductors, a trusted leader in high-quality electronic solutions. This compact and efficient audio amplifier delivers exceptional sound clarity while seamlessly integrating into various applications, from consumer electronics to automotive systems. With its reliable performance and innovative design, you can trust NXP to enhance your projects with superior quality and value, ensuring every note resonates beautifully.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body provides durability and resistance to environmental factors, ensuring long-lasting performance.

Surface Mount: YES

Being a surface mount component allows for easier integration into modern PCB designs, facilitating compact and efficient layouts.

No. of Functions: 2

With two functions, this amplifier provides versatility, allowing for multiple audio applications without needing separate components.

Package Shape: SQUARE

The square package shape optimizes space on the PCB, enabling more compact designs while maintaining performance.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier, this IC is specifically designed for high-quality sound amplification, making it ideal for audio applications.

Power Supplies (V): 1.2/1.5

The ability to operate at low voltage levels (1.2V to 1.5V) enhances power efficiency, making it suitable for battery-operated devices.

No. of Terminals: 32

With 32 terminals, this amplifier can support a variety of connections and configurations, allowing for flexibility in circuit design.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is designed for easy handling and soldering, ensuring reliable connections in electronic applications.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C indicates robust thermal performance, ensuring reliability in varied environments.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C allows this amplifier to function in a wide range of environments, including cooler climates.

Terminal Position: QUAD

The quad terminal position facilitates stable connections and efficient routing on the PCB, improving overall circuit integrity.

Temperature Grade: COMMERCIAL

Commercial temperature grading ensures the product can withstand typical environmental conditions suitable for consumer applications.

Terminal Form: NO LEAD

The no-lead terminal form improves the soldering process and reduces the overall footprint, ideal for space-constrained designs.

Maximum Supply Current: 11 mA

With a maximum supply current of 11 mA, the amplifier is energy-efficient, contributing to longer battery life in portable devices.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for high-density PCB layouts, enabling more components to fit into the same space and enhancing design efficiency.

Technical Specifications

Audio & Video Amplifiers NE58633BS-G attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N32

No. of Functions:

2

No. of Terminals:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

1.2/1.5

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

11 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

NE58633BS-G General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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