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MPXS3010VMM150

NXP Semiconductors

MPXS3010VMM150 by NXP Semiconductors

MPXS3010VMM150 by NXP Semiconductors is a 32-bit microcontroller with 1048576 ROM words, 262144 RAM bytes, and 64 external data bus width. It operates at a max clock frequency of 40 MHz and has PWM channels for industrial applications requiring high-speed processing and precise control.

Median Price

$26.210

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 398 parts In-Stock

1+ parts

$13.280

100+ parts

-

1k+ parts

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398

$13.280

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-

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Rochester

USA . 398 parts In-Stock

1+ parts

-

100+ parts

$26.210

1k+ parts

$23.450

10k+ parts

$22.070

398

-

$26.210

$23.450

$22.070

DigiKey

USA . 398 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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398

-

-

-

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Verical

USA . 398 parts In-Stock

1+ parts

-

100+ parts

$32.763

1k+ parts

$29.313

10k+ parts

$27.587

398

-

$32.763

$29.313

$27.587

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 820 parts In-Stock

1+ parts

$15.948

100+ parts

-

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820

$15.948

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Vyrian

USA . 4,759 parts In-Stock

1+ parts

$16.787

100+ parts

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4,759

$16.787

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Anansix

USA . 1,244 parts In-Stock

1+ parts

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1,244

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DigiKey Marketplace

USA . 398 parts In-Stock

1+ parts

-

100+ parts

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398

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-

Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 20 parts In-Stock

1+ parts

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20

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Rebound Electronics

UK . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 398 parts In-Stock

1+ parts

$13.280

100+ parts

-

1k+ parts

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10k+ parts

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398

$13.280

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Corphita

USA . 515 parts In-Stock

1+ parts

$15.108

100+ parts

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1k+ parts

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515

$15.108

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Component Stockers USA

USA . 901 parts In-Stock

1+ parts

$29.530

100+ parts

$27.750

1k+ parts

-

10k+ parts

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901

$29.530

$27.750

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UNI Independent Distributors

Spain . 7,944 parts In-Stock

1+ parts

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7,944

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Vigor

Singapore . 917 parts In-Stock

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917

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Perfect Parts

USA . 170 parts In-Stock

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170

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Assy Fe

Spain . 8 parts In-Stock

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8

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Overview

Unlock the power of cutting-edge technology with the MPXS3010VMM150 microcontroller by NXP Semiconductors. Designed with precision and innovation, this device offers unparalleled performance in a wide range of applications. From industrial automation to IoT devices, the MPXS3010VMM150 delivers superior quality and reliability. Experience seamless operation and optimized efficiency with this advanced microcontroller, setting new standards in the industry. Elevate your projects with the unmatched value and benefits that only NXP Semiconductors can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Allows for easy and compact integration onto circuit boards, saving space in electronic devices.

Maximum Supply Voltage: 1.32 V

Allows for reliable and stable operation of the microcontroller within the specified voltage range.

Address Bus Width: 32

Enables the microcontroller to access a large memory address space, facilitating efficient data processing and storage.

Package Shape: SQUARE

Facilitates uniform and secure mounting of the microcontroller onto circuit boards.

Bit Size: 32

Provides high processing capability and performance for handling complex tasks and computations.

Power Supplies (V): 1.2,3.3/5

Allows flexibility in power supply options, accommodating different voltage requirements for diverse applications.

No. of Terminals: 257

Offers ample connectivity options for interfacing with external devices and peripherals, enhancing overall functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables a compact and efficient design layout, optimizing space utilization within electronic devices.

Minimum Supply Voltage: 1.14 V

Ensures reliable operation of the microcontroller even at lower voltage levels, enhancing power efficiency.

Maximum Operating Temperature: 105 °C

Allows the microcontroller to function effectively in high-temperature environments, expanding its range of applications.

CPU Family: E200

Belongs to a proven and reliable CPU family, ensuring compatibility and performance consistency.

Minimum Operating Temperature: -40 °C

Enables the microcontroller to operate in extremely cold conditions, making it suitable for diverse environments.

ADC Channels: YES

Supports analog-to-digital conversion, enabling the microcontroller to interface with analog sensors and signals.

DMA Channels: YES

Facilitates direct memory access, enhancing data transfer speed and efficiency for improved performance.

Terminal Position: BOTTOM

Simplifies the installation and connection of the microcontroller within electronic devices.

ROM Words: 1048576

Provides significant storage capacity for program and data storage, accommodating complex software requirements.

Maximum Seated Height: 1.51 mm

Ensures a low-profile design for the microcontroller, suitable for space-constrained applications.

Width: 14 mm

Compact width dimension facilitates easy integration and placement of the microcontroller in electronic designs.

External Data Bus Width: 64

Enables fast data transfer between the microcontroller and external devices, enhancing overall processing speed.

Maximum Clock Frequency: 40 MHz

Operates at a high clock frequency, ensuring swift data processing and execution of instructions.

Maximum Time At Peak Reflow Temperature (s): 40

Withstands peak reflow temperatures for a specified duration, ensuring soldering reliability during manufacturing.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during soldering processes, ensuring component durability.

Length: 14 mm

Compact length dimension contributes to the overall small form factor of the microcontroller.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where robustness and reliability are essential.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for microcontroller applications, ensuring optimal performance and functionality.

RAM Bytes: 262144

Offers ample random-access memory for temporary data storage, facilitating efficient data manipulation and processing.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing energy efficiency and reliability.

Terminal Form: BALL

Ball terminal form simplifies the soldering and connection process during manufacturing.

Maximum Supply Current: 900 mA

Supports high current requirements, ensuring stable operation of the microcontroller under varying load conditions.

Nominal Supply Voltage: 1.2 V

Provides a stable and standard operating voltage for the microcontroller, ensuring consistent performance.

PWM Channels: YES

Supports pulse-width modulation output, enabling precise control of signals for various applications.

ROM Programmability: FLASH

Flash ROM allows for flexible and easy reprogramming of the microcontroller, facilitating firmware updates and enhancements.

Terminal Pitch: 0.8 mm

Compact terminal pitch allows for dense mounting of the microcontroller on circuit boards, optimizing space utilization.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate moisture exposure, ensuring reliability in humid environments.

Speed: 180 rpm

Operates at a high speed for swift data processing and response times in real-time applications.

No. of I/O Lines: 119

Offers numerous input/output lines for connecting external devices and peripherals, enhancing versatility and connectivity.

Technical Specifications

Microcontrollers MPXS3010VMM150 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

E200

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

64

JESD-30 Code:

S-PBGA-B257

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

119

No. of Terminals:

257

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA257,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3/5

Qualification:

Not Qualified

RAM Bytes:

262144

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.51 mm

Speed:

180 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

900 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MPXS3010VMM150 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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