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MPXS2010VMM120

NXP Semiconductors

MPXS2010VMM120 by NXP Semiconductors

MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 257; Package Code: LFBGA; Package Shape: SQUARE;

Median Price

$18.394

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 849 parts In-Stock

1+ parts

$11.050

100+ parts

-

1k+ parts

-

10k+ parts

-

849

$11.050

-

-

-

Rochester

USA . 550 parts In-Stock

1+ parts

-

100+ parts

$16.350

1k+ parts

$14.630

10k+ parts

$13.770

550

-

$16.350

$14.630

$13.770

DigiKey

USA . 550 parts In-Stock

1+ parts

-

100+ parts

$21.510

1k+ parts

-

10k+ parts

-

550

-

$21.510

-

-

Verical

USA . 550 parts In-Stock

1+ parts

-

100+ parts

$20.438

1k+ parts

$19.363

10k+ parts

-

550

-

$20.438

$19.363

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,059 parts In-Stock

1+ parts

$10.498

100+ parts

-

1k+ parts

-

10k+ parts

-

1,059

$10.498

-

-

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Vyrian

USA . 4,667 parts In-Stock

1+ parts

$11.050

100+ parts

-

1k+ parts

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4,667

$11.050

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Anansix

USA . 331 parts In-Stock

1+ parts

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331

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 20 parts In-Stock

1+ parts

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20

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,317 parts In-Stock

1+ parts

$9.945

100+ parts

-

1k+ parts

-

10k+ parts

-

1,317

$9.945

-

-

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Continental Prestige Electronics

USA . 849 parts In-Stock

1+ parts

$11.050

100+ parts

-

1k+ parts

-

10k+ parts

-

849

$11.050

-

-

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Vigor

Singapore . 710 parts In-Stock

1+ parts

$17.480

100+ parts

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710

$17.480

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-

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Microchip USA

USA . 230 parts In-Stock

1+ parts

$25.024

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-

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230

$25.024

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QUARKTWIN TECHNOLOGY LTD

USA . 28,414 parts In-Stock

1+ parts

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1k+ parts

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28,414

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A-Z Elektronik GmbH

Germany . 7,431 parts In-Stock

1+ parts

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7,431

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UNI Independent Distributors

Spain . 3,738 parts In-Stock

1+ parts

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100+ parts

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3,738

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Metaverse IC Inc.

Canada . 556 parts In-Stock

1+ parts

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556

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Technical Specifications

Microcontrollers MPXS2010VMM120 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

64

JESD-30 Code:

S-PBGA-B257

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

119

No. of Terminals:

257

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA257,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.42 mm

Speed:

120 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

380 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MPXS2010VMM120 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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