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MMC2114CFCVF33

NXP Semiconductors

MMC2114CFCVF33 by NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LBGA; Package Shape: SQUARE;

Median Price

$26.570

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 112 parts In-Stock

1+ parts

$23.940

100+ parts

$22.500

1k+ parts

$20.350

10k+ parts

-

112

$23.940

$22.500

$20.350

-

Farnell

UK . 112 parts In-Stock

1+ parts

$29.200

100+ parts

-

1k+ parts

-

10k+ parts

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112

$29.200

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 77 parts In-Stock

1+ parts

$22.743

100+ parts

-

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-

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77

$22.743

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-

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Vyrian

USA . 3,669 parts In-Stock

1+ parts

-

100+ parts

-

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3,669

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Anansix

USA . 2,286 parts In-Stock

1+ parts

-

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2,286

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DigiKey Marketplace

USA . 112 parts In-Stock

1+ parts

-

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112

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Diverse Electronics

Canada . 95 parts In-Stock

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95

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Semi Source

USA . 47 parts In-Stock

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-

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47

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Inventory MP

USA . 6 parts In-Stock

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-

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6

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Bristol Electronics

USA . 6 parts In-Stock

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-

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 64 parts In-Stock

1+ parts

$20.350

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-

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64

$20.350

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Corphita

USA . 1,759 parts In-Stock

1+ parts

$21.546

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1,759

$21.546

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AZTECH Wire

Italy . 3,669 parts In-Stock

1+ parts

$22.580

100+ parts

$21.690

1k+ parts

$21.250

10k+ parts

$20.830

3,669

$22.580

$21.690

$21.250

$20.830

Component Stockers USA

USA . 152 parts In-Stock

1+ parts

$24.240

100+ parts

$22.790

1k+ parts

-

10k+ parts

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152

$24.240

$22.790

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Microchip USA

USA . 2,442 parts In-Stock

1+ parts

$117.405

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2,442

$117.405

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UNI Independent Distributors

Spain . 5,837 parts In-Stock

1+ parts

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5,837

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Technical Specifications

Microcontrollers MMC2114CFCVF33 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

23

Bit Size:

32

Maximum Clock Frequency:

33 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e0

Length:

15 mm

No. of I/O Lines:

105

No. of Terminals:

196

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA196,14X14,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

33 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

15 mm

Peripheral IC Type:

Trade Compliance

MMC2114CFCVF33 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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