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MMC2114CFCAG33

NXP Semiconductors

MMC2114CFCAG33 by NXP Semiconductors

NXP Semiconductors' MMC2114CFCAG33 microcontroller features 32-bit architecture, 3.6V max supply voltage, and 33MHz clock frequency. Ideal for applications requiring high-speed processing and multiple ADC and PWM channels in a compact square package with 144 terminals.

Median Price

$52.350

Lifecycle Status

EOL

Suppliers In-Stock

11

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Arrow

USA . 159 parts In-Stock

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Verical

USA . 159 parts In-Stock

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Chip1Stop

Japan . 294 parts In-Stock

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$44.480

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Digiode

USA . 1,899 parts In-Stock

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$49.732

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Nova Conductors

Japan . 71 parts In-Stock

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Component Sense

UK . 4,569 parts In-Stock

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Flip Electronics

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Chip Stock

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Anansix

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Vyrian

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Semi Source

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AZTECH Wire

Italy . 188 parts In-Stock

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$12.880

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$12.370

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$12.120

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$11.880

188

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$11.880

One Stop Electronics

USA . 204 parts In-Stock

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$44.500

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Semicontronic

India . 204 parts In-Stock

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$44.500

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$43.388

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$43.165

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Ampacity Inc.

Singapore . 125 parts In-Stock

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Corphita

USA . 2,381 parts In-Stock

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$47.115

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Continental Prestige Electronics

USA . 6,943 parts In-Stock

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$48.621

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$47.648

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Aranea Global

USA . 2,000 parts In-Stock

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$51.361

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$49.307

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Corohmni

South Africa . 302 parts In-Stock

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Modulus Dynamics

Lithuania . 1,258 parts In-Stock

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Aztec Data Supply Inc.

USA . 64 parts In-Stock

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Lixinc

USA . 12,604 parts In-Stock

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S.R.D Solutions

India . 8,750 parts In-Stock

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UNI Independent Distributors

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Glotronic Ltd.

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Argo Parts USA

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Robosynatics

Brazil . 977 parts In-Stock

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Lucentia Tech

USA . 977 parts In-Stock

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Authorized Procurement Solutions

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Futuretech Components

Singapore . 100 parts In-Stock

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Advanced Electronics

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iodParts Technologies Inc.

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Overview

Unleash the power of innovation with the NXP Semiconductors MMC2114CFCAG33 microcontroller. Crafted with precision and expertise, this cutting-edge device is designed to revolutionize your projects with its advanced features and unmatched performance. From smart home automation to industrial control systems, this versatile microcontroller offers endless possibilities for your next venture. Elevate your designs and experience seamless integration with the MMC2114CFCAG33 by NXP Semiconductors. Innovation starts here.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and compact installation of the microcontroller on a printed circuit board, making it suitable for mass production.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage provides flexibility in power requirements and compatibility with a wide range of power sources.

Address Bus Width: 23

A wider address bus allows for more memory addressing capability, enabling the microcontroller to handle larger programs and data sets efficiently.

Package Shape: SQUARE

The square package shape is more space-efficient and allows for better utilization of PCB real estate.

Bit Size: 32

A 32-bit architecture provides enhanced processing power and capability, suitable for handling complex tasks and calculations.

No. of Terminals: 144

Having a higher number of terminals allows for more connectivity options and peripheral integration, making the microcontroller versatile for various applications.

Package Style (Meter): FLATPACK

The flatpack package style offers a low-profile design, ideal for space-constrained applications where height clearance is limited.

Minimum Supply Voltage: 2.7 V

The lower minimum supply voltage ensures operation even in low-power scenarios, making the microcontroller energy-efficient and suitable for battery-powered devices.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections and longevity of the microcontroller.

ADC Channels: YES

Analog-to-digital converter (ADC) channels enable the microcontroller to interface with analog sensors and signals, expanding its capability to interact with the physical world.

Terminal Position: QUAD

Quad terminal position allows for easier PCB layout and routing, simplifying the assembly process and reducing the risk of signal interference.

Width: 12 mm

The compact width of 12mm ensures a small footprint, suitable for miniaturized devices and applications with space constraints.

External Data Bus Width: 32

A wide external data bus width of 32 bits enables efficient data transfer between the microcontroller and external memory or peripherals, enhancing overall system performance.

Maximum Clock Frequency: 33 MHz

The high maximum clock frequency of 33 MHz provides fast and responsive operation, making the microcontroller suitable for real-time applications and high-speed data processing.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum time at peak reflow temperature of 40 seconds, the microcontroller can withstand reflow soldering processes without degradation, ensuring reliable manufacturing and assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C enables the microcontroller to withstand elevated temperatures during soldering, ensuring robustness and reliability in manufacturing processes.

Length: 12 mm

The compact length of 12mm complements the small width, offering a space-efficient form factor for applications with tight constraints on PCB size.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller allows for efficient and streamlined instruction execution, enhancing the overall performance and responsiveness of the device.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in various operating environments.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering, ensuring secure connections and durability in assembly and operation.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is a common standard in many electronic systems, ensuring compatibility and ease of integration with existing circuitry and power sources.

PWM Channels: YES

Pulse-width modulation (PWM) channels enable the microcontroller to generate precise analog output signals, making it suitable for applications requiring accurate control of devices such as motors and LEDs.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting and compact PCB design, ideal for applications where space-saving is critical.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 signifies that the microcontroller is capable of withstanding exposure to moderate humidity levels during storage and operation, ensuring long-term reliability in various environmental conditions.

Speed: 33 rpm

The speed specification of 33 rotations per minute (rpm) is likely a placeholder or misinterpretation, as it does not align with typical microcontroller performance metrics. It is recommended to verify and clarify this specification for accurate assessment of the product's capabilities.

No. of I/O Lines: 72

Having 72 I/O lines provides ample connectivity options for interfacing with external devices, sensors, and peripherals, making the microcontroller versatile and adaptable to diverse application requirements.

Technical Specifications

Microcontrollers MMC2114CFCAG33 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

23

Bit Size:

32

Maximum Clock Frequency:

33 MHz

DMA Channels:

NO

External Data Bus Width:

32

JESD-609 Code:

e3

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

72

No. of Terminals:

144

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Speed:

33 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

12 mm

Peripheral IC Type:

Trade Compliance

MMC2114CFCAG33 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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