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MKV10Z64VLF7

NXP Semiconductors

MKV10Z64VLF7 by NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: QFP; Package Shape: SQUARE;

Median Price

$4.924

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,049 parts In-Stock

1+ parts

$7.140

100+ parts

$4.300

1k+ parts

$3.050

10k+ parts

$3.040

1,049

$7.140

$4.300

$3.050

$3.040

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.708

10,000

-

-

-

$2.708

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,178 parts In-Stock

1+ parts

$5.538

100+ parts

-

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-

10k+ parts

-

3,178

$5.538

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-

-

Vyrian

USA . 2,536 parts In-Stock

1+ parts

$5.830

100+ parts

-

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-

10k+ parts

-

2,536

$5.830

-

-

-

Maritex

Poland . 1,149 parts In-Stock

1+ parts

$8.735

100+ parts

$5.407

1k+ parts

$4.798

10k+ parts

$4.337

1,149

$8.735

$5.407

$4.798

$4.337

Cyclops Electronics Ltd

UK . 1,250 parts In-Stock

1+ parts

-

100+ parts

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1,250

-

-

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Anansix

USA . 641 parts In-Stock

1+ parts

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641

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,055 parts In-Stock

1+ parts

$4.960

100+ parts

-

1k+ parts

-

10k+ parts

-

1,055

$4.960

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-

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Corphita

USA . 4,402 parts In-Stock

1+ parts

$5.247

100+ parts

-

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10k+ parts

-

4,402

$5.247

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Microchip USA

USA . 2,760 parts In-Stock

1+ parts

$22.629

100+ parts

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2,760

$22.629

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UNI Independent Distributors

Spain . 5,014 parts In-Stock

1+ parts

-

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5,014

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Epart123

USA . 3,750 parts In-Stock

1+ parts

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$54.500

3,750

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$54.500

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Technical Specifications

Microcontrollers MKV10Z64VLF7 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

40

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Speed:

75 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Trade Compliance

MKV10Z64VLF7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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