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MK11DN512AVMC5

NXP Semiconductors

MK11DN512AVMC5 by NXP Semiconductors

The NXP Semiconductors MK11DN512AVMC5 is a RISC microcontroller with CMOS technology. It features a peak reflow temperature of 260°C and can withstand up to 40 seconds at this temperature. Ideal for applications requiring high-performance microcontrollers with advanced processing capabilities.

Median Price

$11.220

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 2,361 parts In-Stock

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Avnet

USA . 1,562 parts In-Stock

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$8.077

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$6.733

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$6.733

DigiKey

USA . 621 parts In-Stock

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$11.220

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621

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Verical

USA . 621 parts In-Stock

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$12.950

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Nova Conductors

Japan . 300 parts In-Stock

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$10.753

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300

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Digiode

USA . 3,428 parts In-Stock

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Flip Electronics

USA . 2,361 parts In-Stock

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Anansix

USA . 1,820 parts In-Stock

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Vyrian

USA . 1,349 parts In-Stock

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Ampacity Inc.

Singapore . 1,244 parts In-Stock

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$9.540

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Continental Prestige Electronics

USA . 6,337 parts In-Stock

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$10.753

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$10.538

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Netroflash

USA . 100 parts In-Stock

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$10.753

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100

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One Stop Electronics

USA . 1,429 parts In-Stock

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$20.760

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Microchip USA

USA . 2,636 parts In-Stock

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$38.248

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Aztec Data Supply Inc.

USA . 2,297 parts In-Stock

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$60.934

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Corohmni

South Africa . 199 parts In-Stock

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$65.519

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Lixinc

USA . 19,226 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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UNI Independent Distributors

Spain . 2,602 parts In-Stock

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Perfect Parts

USA . 780 parts In-Stock

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780

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Argo Parts USA

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297

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Corphita

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Overview

Unleash the power of innovation with the MK11DN512AVMC5 by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-notch quality and reliability in their microcontrollers. This versatile product is perfect for a wide range of applications, offering unparalleled value and performance. Experience seamless operation and enhanced efficiency with the MK11DN512AVMC5, the ultimate choice for your next project.

Feature Benefit Bullets

Terminal Finish: TIN

Tin terminal finish provides good solderability and is low cost, making it a reliable choice for a microcontroller product.

Terminal Finish: SILVER

Silver terminal finish provides excellent conductivity and corrosion resistance, enhancing the overall performance and longevity of the microcontroller.

Terminal Finish: COPPER

Copper terminal finish offers high thermal conductivity and compatibility with lead-free soldering, ensuring reliability and efficiency of the microcontroller.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum reflow time of 40 seconds, this microcontroller can withstand the necessary soldering process without compromising its functionality.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering of the microcontroller components, leading to a durable and stable product.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller allows for efficient processing of instructions, enhancing the overall performance and speed of the product.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microcontroller suitable for a wide range of applications.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, this microcontroller has moderate sensitivity to moisture, ensuring its reliability and stability under normal operating conditions.

Technical Specifications

Microcontrollers MK11DN512AVMC5 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Maximum Time At Peak Reflow Temperature (s):

40

Peripheral IC Type:

Trade Compliance

MK11DN512AVMC5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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