Loading...

MCZ33812AEK

NXP Semiconductors

MCZ33812AEK by NXP Semiconductors

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: HSSOP; Package Shape: RECTANGULAR;

Median Price

$1.785

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

MCZ33812AEK by NXP Semiconductors
Compare Share

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 142 parts In-Stock

1+ parts

$1.820

100+ parts

-

1k+ parts

-

10k+ parts

-

142

$1.820

-

-

-

Rochester

USA . 142 parts In-Stock

1+ parts

-

100+ parts

$1.750

1k+ parts

$1.560

10k+ parts

$1.470

142

-

$1.750

$1.560

$1.470

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,140 parts In-Stock

1+ parts

$1.729

100+ parts

-

1k+ parts

-

10k+ parts

-

4,140

$1.729

-

-

-

Vyrian

USA . 8,702 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,702

-

-

-

-

Anansix

USA . 841 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

841

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 8,702 parts In-Stock

1+ parts

$1.520

100+ parts

$1.460

1k+ parts

$1.430

10k+ parts

$1.400

8,702

$1.520

$1.460

$1.430

$1.400

One Stop Electronics

USA . 142 parts In-Stock

1+ parts

$1.550

100+ parts

-

1k+ parts

-

10k+ parts

-

142

$1.550

-

-

-

Corphita

USA . 457 parts In-Stock

1+ parts

$1.638

100+ parts

-

1k+ parts

-

10k+ parts

-

457

$1.638

-

-

-

Component Stockers USA

USA . 168 parts In-Stock

1+ parts

$1.970

100+ parts

$1.850

1k+ parts

-

10k+ parts

-

168

$1.970

$1.850

-

-

Microchip USA

USA . 1,525 parts In-Stock

1+ parts

$12.155

100+ parts

-

1k+ parts

-

10k+ parts

-

1,525

$12.155

-

-

-

UNI Independent Distributors

Spain . 7,560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,560

-

-

-

-

Perfect Parts

USA . 78 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

78

-

-

-

-

Technical Specifications

Peripheral Drivers MCZ33812AEK attributes and parameters. Explore more Peripheral Drivers devices from NXP Semiconductors

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Length:

11 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

4.7 V

Nominal Supply Voltage:

14 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

MCZ33812AEK Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20