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MC908GT16CBE

NXP Semiconductors

MC908GT16CBE by NXP Semiconductors

MICROCONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 42; Package Code: SDIP; Package Shape: RECTANGULAR;

Median Price

$5.275

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 14,061 parts In-Stock

1+ parts

-

100+ parts

$4.220

1k+ parts

$3.770

10k+ parts

$3.550

14,061

-

$4.220

$3.770

$3.550

DigiKey

USA . 13,836 parts In-Stock

1+ parts

-

100+ parts

$5.550

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-

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13,836

-

$5.550

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Verical

USA . 13,280 parts In-Stock

1+ parts

-

100+ parts

$5.275

1k+ parts

$4.713

10k+ parts

$4.438

13,280

-

$5.275

$4.713

$4.438

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,035 parts In-Stock

1+ parts

$4.456

100+ parts

-

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-

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-

2,035

$4.456

-

-

-

Vyrian

USA . 3,937 parts In-Stock

1+ parts

$4.690

100+ parts

-

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-

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3,937

$4.690

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DigiKey Marketplace

USA . 12,969 parts In-Stock

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12,969

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-

-

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Bristol Electronics

USA . 429 parts In-Stock

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429

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Anansix

USA . 243 parts In-Stock

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243

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 961 parts In-Stock

1+ parts

$4.221

100+ parts

-

1k+ parts

-

10k+ parts

-

961

$4.221

-

-

-

Microchip USA

USA . 440 parts In-Stock

1+ parts

$6.737

100+ parts

-

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440

$6.737

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QUARKTWIN TECHNOLOGY LTD

USA . 27,912 parts In-Stock

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27,912

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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25,000

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-

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Metaverse IC Inc.

Canada . 25,000 parts In-Stock

1+ parts

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25,000

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-

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Vigor

Singapore . 14,646 parts In-Stock

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14,646

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UNI Independent Distributors

Spain . 8,190 parts In-Stock

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8,190

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A-Z Elektronik GmbH

Germany . 3,750 parts In-Stock

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3,750

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Technical Specifications

Microcontrollers MC908GT16CBE attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 3V SUPPLY @ 4 MHZ

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T42

JESD-609 Code:

e3

Length:

36.83 mm

No. of I/O Lines:

34

No. of Terminals:

42

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

5.08 mm

Speed:

8 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

15.24 mm

Peripheral IC Type:

Trade Compliance

MC908GT16CBE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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