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MC908GP32CFBE

NXP Semiconductors

MC908GP32CFBE by NXP Semiconductors

MC908GP32CFBE by NXP Semiconductors is an 8-bit microcontroller with a clock frequency of 32.8 MHz, suitable for industrial applications. It features 33 I/O lines, PWM channels, and ADC channels, with a supply voltage range of 4.5V to 5.5V. The package style is flatpack with GULL WING terminals and operates in temperatures ranging from -40°C to 85°C.

Median Price

$24.500

Lifecycle Status

Suppliers In-Stock

34

In-Stock Inventory

1k+

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Chip1Stop

Japan . 474 parts In-Stock

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$17.700

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Farnell

UK . 382 parts In-Stock

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$20.880

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$14.680

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Arrow

USA . 6,171 parts In-Stock

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$22.160

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$15.540

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$13.910

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Verical

USA . 5,867 parts In-Stock

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$26.840

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$16.290

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Mouser Electronics

USA . 443 parts In-Stock

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$27.800

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DigiKey

USA . 317 parts In-Stock

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Element14

Singapore . 277 parts In-Stock

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$35.260

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$23.810

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Flip Electronics (Authorized)

USA . 4,536 parts In-Stock

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Future Electronics

Canada . 2,227 parts In-Stock

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Avnet

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Distrelec

Netherlands . 96 parts In-Stock

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Digiode

USA . 2,268 parts In-Stock

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$17.888

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Nova Conductors

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Maritex

Poland . 464 parts In-Stock

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$14.822

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Cyclops Electronics Ltd

UK . 58,545 parts In-Stock

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Sensible Micro Corp

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IBS Electronics

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Vyrian

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Chip Stock

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Bristol Electronics

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Atlantic Semiconductor

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Martec Srl

Italy . 331 parts In-Stock

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North Shore Components

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Lantek

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Global Solutions Electronics Company

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J2 Sourcing AB

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PC Components Company LLC

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Prism Electronics

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Semicontronic

India . 1,643 parts In-Stock

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$16.010

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$15.610

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$15.530

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Ampacity Inc.

Singapore . 1,609 parts In-Stock

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Corphita

USA . 2,337 parts In-Stock

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Continental Prestige Electronics

USA . 6,745 parts In-Stock

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$18.090

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$17.728

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Netroflash

USA . 2,000 parts In-Stock

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$18.100

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$17.195

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$16.833

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Vigor

Singapore . 1,479 parts In-Stock

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$19.390

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Aztec Data Supply Inc.

USA . 2,589 parts In-Stock

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$32.093

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Corohmni

South Africa . 400 parts In-Stock

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$48.514

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Modulus Dynamics

Lithuania . 302 parts In-Stock

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$71.915

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$71.915

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$71.915

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S.R.D Solutions

India . 100,697 parts In-Stock

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Perfect Parts

USA . 24,488 parts In-Stock

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A-Z Elektronik GmbH

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UNI Independent Distributors

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Lixinc

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Argo Parts USA

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Robosynatics

Brazil . 1,247 parts In-Stock

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$56.194

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$55.047

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$55.047

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$55.047

Lucentia Tech

USA . 1,247 parts In-Stock

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$56.194

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$55.047

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XScomponents

USA . 576 parts In-Stock

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Futuretech Components

Singapore . 180 parts In-Stock

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Advanced Electronics

New Zealand . 84 parts In-Stock

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iodParts Technologies Inc.

India . 66 parts In-Stock

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GreenTree Electronics

Israel . 66 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Kepictronics

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Israel . 36 parts In-Stock

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Overview

Discover the power and precision of the MC908GP32CFBE microcontroller by NXP Semiconductors. Crafted with precision and expertise, this device offers unparalleled performance in a wide range of applications. From automation to automotive, this microcontroller delivers reliability and efficiency that exceeds expectations. Unlock new possibilities and streamline your projects with the innovative technology and cutting-edge design of the MC908GP32CFBE. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Surface Mount: YES

Easy to install and integrate into circuit boards.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage requirements, providing flexibility in design.

Package Shape: SQUARE

Compact design, optimized for space efficiency.

Bit Size: 8

Suitable for processing data in small chunks efficiently.

No. of Terminals: 44

Provides ample connectivity options for peripherals and external devices.

Package Style (Meter): FLATPACK

Easily mountable and ideal for densely populated PCB designs.

Maximum Operating Temperature: 85 °C

Can withstand higher temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Operational in extreme cold conditions, expanding usability.

Terminal Finish: TIN

Provides good conductivity and corrosion resistance for long-term reliability.

ADC Channels: YES

Ability to convert analog signals to digital, making it versatile for sensor interfacing.

Terminal Position: QUAD

Allows for easy placement on the PCB and efficient routing of connections.

Maximum Seated Height: 2.45 mm

Low profile design suitable for compact electronic devices.

Width: 10 mm

Compact form factor, suitable for small electronic designs.

Maximum Clock Frequency: 32.8 MHz

High clock speed for quick processing of instructions.

Maximum Time At Peak Reflow Temperature (s): 40

Allows for proper reflow soldering during assembly.

Peak Reflow Temperature °C: 260

Can withstand high-temperature reflow soldering processes.

Length: 10 mm

Compact form factor suitable for small electronic designs.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER

Specifically designed for control and processing tasks in embedded systems.

Technology: CMOS

Low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Easy to solder and suitable for automated assembly processes.

Nominal Supply Voltage: 5 V

Stable voltage supply for consistent performance.

PWM Channels: YES

Allows for precise control of connected devices.

ROM Programmability: FLASH

Flexible and electrically erasable program memory for easy updates.

Terminal Pitch: 0.8 mm

Fine pitch for high-density mounting and efficient use of PCB space.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering and moisture-resistant encapsulation.

Speed: 8.2 rpm

High processing speed for quick execution of tasks.

No. of I/O Lines: 33

Provides sufficient input and output options for interfacing with external devices.

Technical Specifications

Microcontrollers MC908GP32CFBE attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY AT 4.1 MHZ

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

32.8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

2.45 mm

Speed:

8.2 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MC908GP32CFBE Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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