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MC145406D,512

NXP Semiconductors

MC145406D,512 by NXP Semiconductors

LINE TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,386 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,386

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Digiode

USA . 3,358 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,358

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Anansix

USA . 977 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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977

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 304 parts In-Stock

1+ parts

$0.860

100+ parts

-

1k+ parts

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10k+ parts

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304

$0.860

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AZTECH Wire

Italy . 183 parts In-Stock

1+ parts

$11.910

100+ parts

-

1k+ parts

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10k+ parts

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183

$11.910

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One Stop Electronics

USA . 833 parts In-Stock

1+ parts

$20.500

100+ parts

-

1k+ parts

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833

$20.500

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Component Stockers USA

USA . 386 parts In-Stock

1+ parts

$99.990

100+ parts

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1k+ parts

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386

$99.990

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UNI Independent Distributors

Spain . 6,933 parts In-Stock

1+ parts

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100+ parts

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6,933

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Corphita

USA . 4,711 parts In-Stock

1+ parts

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4,711

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Technical Specifications

Line Drivers & Receivers MC145406D,512 attributes and parameters. Explore more Line Drivers & Receivers devices from NXP Semiconductors

Specs

Differential Output:

NO

Driver No. of Bits:

3

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-D; V.28

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

Nominal Negative Supply Voltage:

-12 V

No. of Functions:

3

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

7.5 V

Output Characteristics:

TOTEM-POLE

Maximum Output Low Current:

4 Amp

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5,+-5/+-12

Qualification:

Not Qualified

Maximum Receive Delay:

425 ns

Receiver No. of Bits:

3

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

13.2 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

12 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

500 ns

Width:

7.5 mm

Trade Compliance

MC145406D,512 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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