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MAX7311AWG

NXP Semiconductors

MAX7311AWG by NXP Semiconductors

NXP Semiconductors' MAX7311AWG is a 16-bit Parallel I/O Port with 2-5.5V power supplies, operating from -40 to 125°C. This BICMOS technology chip comes in a small outline package and is ideal for automotive applications due to its robust design and gull wing terminals.

Median Price

$12.640

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

MAX7311AWG by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 651 parts In-Stock

1+ parts

$12.640

100+ parts

$9.135

1k+ parts

$7.931

10k+ parts

$7.756

651

$12.640

$9.135

$7.931

$7.756

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$5.196

100+ parts

-

1k+ parts

-

10k+ parts

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750

$5.196

-

-

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Digiode

USA . 1,936 parts In-Stock

1+ parts

$10.906

100+ parts

-

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-

10k+ parts

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1,936

$10.906

-

-

-

Anansix

USA . 1,595 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,595

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-

-

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PC Components Company LLC

USA . 710 parts In-Stock

1+ parts

-

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1k+ parts

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710

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Vyrian

USA . 647 parts In-Stock

1+ parts

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647

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Bristol Electronics

USA . 323 parts In-Stock

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323

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Prism Electronics

USA . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

$5.196

100+ parts

$4.936

1k+ parts

$4.689

10k+ parts

$4.624

300

$5.196

$4.936

$4.689

$4.624

Continental Prestige Electronics

USA . 4,295 parts In-Stock

1+ parts

$5.196

100+ parts

-

1k+ parts

-

10k+ parts

$5.093

4,295

$5.196

-

-

$5.093

Component Stockers USA

USA . 34,469 parts In-Stock

1+ parts

$7.750

100+ parts

$6.680

1k+ parts

$3.860

10k+ parts

$3.860

34,469

$7.750

$6.680

$3.860

$3.860

Semicontronic

India . 1,063 parts In-Stock

1+ parts

$9.760

100+ parts

$9.516

1k+ parts

$9.467

10k+ parts

-

1,063

$9.760

$9.516

$9.467

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Ampacity Inc.

Singapore . 838 parts In-Stock

1+ parts

$9.760

100+ parts

-

1k+ parts

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838

$9.760

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-

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One Stop Electronics

USA . 814 parts In-Stock

1+ parts

$9.760

100+ parts

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1k+ parts

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10k+ parts

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814

$9.760

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-

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Corphita

USA . 5,316 parts In-Stock

1+ parts

$10.332

100+ parts

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10k+ parts

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5,316

$10.332

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MARBEL Systems

Belgium . 910 parts In-Stock

1+ parts

$27.435

100+ parts

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10k+ parts

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910

$27.435

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Texas Native Microelectronics

USA . 200 parts In-Stock

1+ parts

$31.535

100+ parts

-

1k+ parts

-

10k+ parts

$27.751

200

$31.535

-

-

$27.751

Kenton Components

USA . 4,067 parts In-Stock

1+ parts

$37.842

100+ parts

-

1k+ parts

-

10k+ parts

$33.301

4,067

$37.842

-

-

$33.301

Qasali Group International

UK . 500 parts In-Stock

1+ parts

$85.144

100+ parts

-

1k+ parts

-

10k+ parts

$74.927

500

$85.144

-

-

$74.927

Corohmni

South Africa . 2,433 parts In-Stock

1+ parts

$86.541

100+ parts

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10k+ parts

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2,433

$86.541

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UNI Independent Distributors

Spain . 3,449 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,449

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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-

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Argo Parts USA

USA . 1,269 parts In-Stock

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1,269

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-

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Kepictronics

USA . 100 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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100

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-

Overview

Upgrade your electronic designs with the MAX7311AWG from NXP Semiconductors, a leading manufacturer known for top-quality components. This Parallel I/O Port offers 16 bits of functionality in a small outline package, making it ideal for automotive applications. With a wide operating temperature range and dual terminal position, this product provides reliability and versatility. Trust NXP Semiconductors to deliver cutting-edge technology that meets your needs. Choose the MAX7311AWG for superior performance and seamless integration into your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection, making the product suitable for various environments.

Surface Mount: YES

Allows for easy and convenient installation on a PCB, saving space and reducing assembly time.

No. of Bits: 16

High number of bits allows for processing and transferring larger amounts of data simultaneously.

Power Supplies (V): 2/5.5

Wide range of power supply options allows for flexibility in powering the device.

No. of Terminals: 24

Sufficient number of terminals for connecting to other components and peripherals.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability even in harsh conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in a wide range of environments.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high speed and low power consumption.

Technical Specifications

Parallel I/O Ports MAX7311AWG attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G24

No. of Bits:

16

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2/5.5

Qualification:

Not Qualified

Sub-Category:

Parallel IO Port

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

MAX7311AWG Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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