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LD6806F/33H,115

NXP Semiconductors

LD6806F/33H,115 by NXP Semiconductors

LD6806F/33H,115 from NXP Semiconductors is a compact CMOS regulator with a fixed output of 3.3 V and a max load current of 0.2 A. It operates b/w -40 °C to 125 °C, ensuring reliability in various applications. Ideal for space-constrained designs due to its no-lead package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,770 parts In-Stock

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7,770

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Digiode

USA . 2,395 parts In-Stock

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2,395

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Anansix

USA . 1,763 parts In-Stock

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1,763

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Microchip USA

USA . 356 parts In-Stock

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$0.439

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356

$0.439

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One Stop Electronics

USA . 630 parts In-Stock

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$9.500

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630

$9.500

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AZTECH Wire

Italy . 1,148 parts In-Stock

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$16.510

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$16.510

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Component Stockers USA

USA . 556 parts In-Stock

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$99.990

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556

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UNI Independent Distributors

Spain . 3,616 parts In-Stock

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Corphita

USA . 3,588 parts In-Stock

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Overview

Elevate your designs with the LD6806F/33H,115 from NXP Semiconductors—a leader in innovation and reliability. This compact surface-mount regulator delivers exceptional performance in diverse applications, ensuring stable power supply even in extreme conditions. With a steadfast output of 3.3V and remarkable efficiency, it enhances device longevity while simplifying integration. Trust NXP for superior quality that drives success in your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body enhances durability and resistance to environmental factors, making this product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easier integration into compact designs, saving board space and enabling higher density layouts.

Operating Temperature (TJ-Max): 125 °C

With a maximum operating temperature of 125 °C, this regulator can function effectively in high-temperature environments, ensuring reliability in harsh conditions.

Technology: CMOS

CMOS technology provides low power consumption and high performance, making this regulator energy-efficient and suitable for battery-powered devices.

Package Shape: RECTANGULAR

The rectangular shape contributes to consistent layout design and efficient heat dissipation, enhancing overall product performance.

Terminal Form: NO LEAD

No lead design improves the compactness of the product and simplifies PCB assembly, promoting a cleaner and more organized layout.

Operating Temperature (TJ-Min): -40 °C

With a minimum operating temperature of -40 °C, this regulator is capable of functioning in extremely low-temperature environments, ensuring versatility across applications.

Packing Method: TR

The tape and reel packing method allows for easy handling and automated assembly processes, reducing production time and increasing efficiency.

Maximum Voltage Tolerance: 3 %

A maximum voltage tolerance of 3% ensures stable operation and enhances reliability over varying input conditions, making this product dependable.

Nominal Output Voltage-1: 3.3 V

The nominal output voltage of 3.3 V is ideal for powering a wide range of digital devices, facilitating versatility in applications.

No. of Terminals: 6

The six-terminal configuration provides sufficient connectivity options while maintaining a compact footprint, allowing for efficient circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to an overall reduction in size, making it suitable for space-constrained applications.

Adjustability: FIXED

With fixed output, the regulator simplifies design and reduces the need for additional components, providing ease of use for designers.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for dense PCB layouts and supports high-frequency applications, making this product ideal for modern electronics.

Maximum Line Regulation: 0.0066 %

Excellent line regulation ensures minimal variation in output voltage with changing input, providing a stable power supply for sensitive loads.

Terminal Position: DUAL

The dual terminal position offers flexible PCB layout options, which is beneficial for optimizing space and routing.

Maximum Load Regulation: 0.13134 %

High load regulation ensures consistent output voltage under varying load conditions, making this regulator reliable for critical applications.

Maximum Output Current-1: 0.2 A

With a maximum output current of 0.2 A, this regulator can drive moderately powered devices, catering to a range of electronic applications.

Nominal Dropout Voltage-1: 0.08 V

A low dropout voltage of 0.08 V allows for efficient operation even when input voltage is close to the output voltage, enhancing the regulator's performance.

Maximum Input Voltage Absolute: 6 V

The maximum input voltage of 6 V provides a wide margin for input variations, allowing for compatibility with various power sources in designs.

Technical Specifications

Other Function Regulators LD6806F/33H,115 attributes and parameters. Explore more Other Function Regulators devices from NXP Semiconductors

Specs

Adjustability:

FIXED

Nominal Dropout Voltage-1:

.08 V

Maximum Input Voltage Absolute:

6 V

JESD-30 Code:

R-PDSO-N6

Maximum Line Regulation:

.0066 %

Maximum Load Regulation:

.13134 %

No. of Outputs:

1

No. of Terminals:

6

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.2 A

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Qualification Status:

Not Qualified

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

3 %

Trade Compliance

LD6806F/33H,115 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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