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KMA199E

NXP Semiconductors

KMA199E by NXP Semiconductors

MAGNETIC FIELD SENSOR,MAGNETORESISTIVE; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: -0.3-6V; Maximum Operating Current: 10 mA;

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 722 parts In-Stock

1+ parts

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722

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Anansix

USA . 458 parts In-Stock

1+ parts

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458

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Vyrian

USA . 81 parts In-Stock

1+ parts

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81

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,480 parts In-Stock

1+ parts

$3.750

100+ parts

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10k+ parts

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1,480

$3.750

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Kepictronics

USA . 5,400 parts In-Stock

1+ parts

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5,400

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Corphita

USA . 4,032 parts In-Stock

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4,032

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UNI Independent Distributors

Spain . 1,785 parts In-Stock

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1,785

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Technical Specifications

Magnetic Field Sensors KMA199E attributes and parameters. Explore more Magnetic Field Sensors devices from NXP Semiconductors

Specs

Additional Features:

RADIOMETRIC OUTPUT

Body Width:

1.55 inch

Body Length/Diameter:

6.37 mm

Housing:

PLASTIC

JESD-609 Code:

e3

Maximum Magnetic Field Range:

43.75 mT

Mounting Feature:

Maximum Operating Current:

10 mA

Maximum Operating Temperature:

160 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2 A

Output Interface Type:

1-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Resistance:

5000 ohm

Sensors or Transducers Type:

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Terminal Finish:

Tin (Sn)

Termination Type:

SOLDER

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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