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IP4253CZ12-6-TTL,1

NXP Semiconductors

IP4253CZ12-6-TTL,1 by NXP Semiconductors

IP4253CZ12-6-TTL,1 from NXP Semiconductors is a 12-terminal data line filter designed for surface mount applications. It operates b/w -40 °C and 85 °C, ensuring reliable performance in various environments. Ideal for protecting sensitive electronics from noise and interference.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 168,000 parts In-Stock

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168,000

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Vyrian

USA . 3,975 parts In-Stock

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3,975

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Anansix

USA . 2,333 parts In-Stock

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2,333

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Digiode

USA . 226 parts In-Stock

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226

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 357 parts In-Stock

1+ parts

$0.400

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357

$0.400

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AZTECH Wire

Italy . 515 parts In-Stock

1+ parts

$10.010

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515

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UNI Independent Distributors

Spain . 7,783 parts In-Stock

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7,783

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Corphita

USA . 4,188 parts In-Stock

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Overview

Elevate your designs with the IP4253CZ12-6-TTL from NXP Semiconductors, a trusted leader in innovation. This high-quality data line filter ensures superior protection against noise and interference, enhancing the reliability of your electronic applications. With a robust temperature range suitable for diverse environments, it seamlessly fits into surface-mount projects. Experience enhanced performance and peace of mind, knowing you're backed by NXP’s commitment to excellence.

Feature Benefit Bullets

No. of Terminals: 12

Having 12 terminals allows for versatile connectivity and ease of integration in various data line applications, making this filter suitable for complex designs.

Filter Type: DATA LINE FILTER

Designed specifically for data line applications, this filter effectively reduces noise and ensures signal integrity, which is crucial for high-performance data transmission.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this filter can operate effectively in high-temperature environments, making it reliable for demanding applications.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures this filter can perform in extremely cold conditions, enhancing its versatility in various climates.

Mounting Type: SURFACE MOUNT

Surface mount technology allows for compact design and easy integration into modern electronics, making this filter suitable for space-constrained applications.

Package Material: PLASTIC

The use of durable plastic for the package material makes the product lightweight and resistant to environmental factors, ensuring longevity and robustness.

Technical Specifications

Data Line Filters IP4253CZ12-6-TTL,1 attributes and parameters. Explore more Data Line Filters devices from NXP Semiconductors

Specs

Filter Type:

Mounting Type:

SURFACE MOUNT

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Material:

PLASTIC

Sub-Category:

Data Line Filters

Trade Compliance

IP4253CZ12-6-TTL,1 Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8504.50.80.00

SB

8504.50.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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