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ICM7555CN

NXP Semiconductors

ICM7555CN by NXP Semiconductors

ICM7555CN by NXP Semiconductors is a CMOS analog waveform generator with a max output frequency of 0.5 GHz and operates b/w 3-16 V. It features an 8-terminal, dual in-line package suitable for commercial applications. With a temp range of 0-70 °C, it's ideal for various electronic circuits.

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Digiode

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LIBRA Elektronik GmbH

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Semi Source

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Speed Components Ltd

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LWI Electronics Inc

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A2Z Electronics, Inc.

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Inland Empire Components Inc.

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Mentor Electronics Marketing, LLC

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Fibra_Brandt Electronic GMBH

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LittleDiode

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Rebound Electronics

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Bristol Electronics

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Manoshevitz Elec. Sales

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One Stop Electronics

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Overview

Unleash the power of precision with the ICM7555CN from NXP Semiconductors, a leader in analog waveform generation. Designed for versatility and reliability, this robust CMOS device excels in generating accurate pulse signals across an array of applications—be it timers, oscillators, or frequency modulation. With exceptional performance and a commercial-grade temperature range, the ICM7555CN ensures your projects achieve peak efficiency, delivering unmatched value and performance to elevate your electronic designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and helps protect the internal components from environmental factors, making the product suitable for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of PCB space, facilitating easier layout and integration into different designs.

Nominal Supply Voltage (Vsup): 5 V

5V nominal supply makes this product compatible with a wide range of existing systems, ensuring ease of integration in various electronic circuits.

Maximum Output Frequency: 0.5 GHz

With a high output frequency of 0.5 GHz, this product is capable of generating fast signal waveforms, making it ideal for high-speed applications.

Power Supplies (V): 5/15

The dual power supply options of 5V and 15V provide flexibility for different operational needs, enhancing versatility in design applications.

No. of Terminals: 8

Eight terminals allow for multiple connections, facilitating complex circuit designs while remaining easy to work with for engineers.

Package Style (Meter): IN-LINE

The in-line package style simplifies mounting on PCBs, offering ease of assembly and reducing space requirements.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C enables reliable performance in moderately warm environments without risk of failure.

Minimum Operating Temperature: 0 °C

This ensures reliable operation in cooler conditions, widening the range of environments suitable for this product.

Terminal Position: DUAL

Dual terminal positioning enhances the product's compatibility with various board layouts and standards, making it versatile for engineers.

Maximum Seated Height: 4.2 mm

The low seated height allows for a more compact design, which is advantageous for projects where space is limited.

Width: 7.62 mm

A width of 7.62 mm provides a good balance between compactness and accessibility for soldering and component placement.

Other IC type: PULSE

As a pulse IC, this product is specifically designed to generate pulse waveforms, which are essential in various timing and control applications.

Minimum Supply Voltage (Vsup): 3 V

A minimum supply voltage of 3V enables the device to operate in lower-voltage scenarios, increasing compatibility with battery-operated devices.

Maximum Time At Peak Reflow Temperature: 40 s

This specification ensures that the device withstands the PCB soldering process without damage, enhancing production reliability.

Peak Reflow Temperature: 250 °C

The high tolerance to reflow temperatures ensures the device can endure modern soldering techniques without compromising performance.

Length: 9.5 mm

The length of 9.5 mm provides a compact form factor while allowing enough space for robust connection options.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that this product is designed for general use and is reliable in typical operating conditions.

Technology: CMOS

Using CMOS technology enables lower power consumption while maintaining high-speed performance, making it suitable for energy-conscious designs.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enhances mechanical stability in applications where durability and reliability are critical.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm makes it compatible with standard PCB layouts, facilitating easy integration in existing designs.

Maximum Supply Voltage (Vsup): 16 V

The high maximum supply voltage of 16V offers ample versatility for various applications requiring higher power levels.

Technical Specifications

Analog Waveform Generation ICM7555CN attributes and parameters. Explore more Analog Waveform Generation devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T8

Length:

9.5 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Frequency:

.5 GHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

7.62 mm

Trade Compliance

ICM7555CN Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-361-4779, 5962013614779

NIIN

013614779

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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