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I74F166D-T

NXP Semiconductors

I74F166D-T by NXP Semiconductors

I74F166D-T by NXP Semiconductors is an 8-bit digital shift register designed for industrial applications. It operates at a nominal voltage of 5V with a max temp of 85 °C and features a fast propagation delay of just 13 ns. Ideal for high-speed data processing, it supports positive edge triggering and has a max frequency of 100 MHz.

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Lifecycle Status

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3

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1k+

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USA . 1,402 parts In-Stock

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Anansix

USA . 1,119 parts In-Stock

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Digiode

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One Stop Electronics

USA . 368 parts In-Stock

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UNI Independent Distributors

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Corphita

USA . 1,407 parts In-Stock

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Overview

Elevate your designs with the I74F166D-T from NXP Semiconductors, a trusted leader in innovative digital solutions. This robust 8-bit shift register combines reliability and speed, making it perfect for industrial applications where precision matters. Its compact design and superior performance empower engineers to achieve seamless data handling, ensuring efficiency and durability in every project. Choose NXP for quality that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures a lightweight and durable package, suitable for various applications.

Surface Mount: YES

The surface-mount design allows for efficient space utilization on PCBs and facilitates automated assembly.

Package Shape: RECTANGULAR

The rectangular shape is common and easily integrates into existing designs.

No. of Bits: 8

An 8-bit configuration balances complexity and functionality, making it ideal for wide-ranging digital applications.

Nominal Supply Voltage / Vsup: 5 V

A nominal voltage of 5V is standard in digital electronics, ensuring compatibility with many systems.

Load Capacitance (CL): 50 pF

A low load capacitance allows for faster switching speeds, enhancing system responsiveness.

No. of Terminals: 16

16 terminals provide ample connectivity options for interfacing with other components in a circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style is compact, making it suitable for space-constrained applications.

Propagation Delay (tpd): 13 ns

A short propagation delay ensures rapid signal transmission, critical for high-speed applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature rating indicates reliability in demanding environments.

Trigger Type: POSITIVE EDGE

Positive edge triggering provides stable operation and precise timing for synchronous applications.

Minimum Operating Temperature: -40 °C

An extended operating temperature range makes this product suitable for industrial and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish ensures excellent corrosion resistance and enhances solderability.

Terminal Position: DUAL

Dual terminal positions facilitate versatile PCB layout options, accommodating various design needs.

Output Polarity: TRUE

True output polarity ensures output signals are in-line with the input logic, simplifying design.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5V allows for flexibility in power supply design.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature ranges, this product is robust for use in harsh environments.

Technology: TTL

Using TTL technology ensures compatibility with a wide variety of TTL circuits and components.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical connections and ease of soldering.

Count Direction: RIGHT

Right count direction is the standard for many digital applications, promoting integration with existing designs.

Minimum fmax: 100 MHz

A minimum frequency of 100 MHz indicates the device can handle high-speed applications effectively.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage provides flexibility in power supply design, accommodating variations in source voltage.

Maximum Power Supply Current (ICC): 70 mA

With a maximum supply current of 70 mA, it can drive sufficient loads suitable for most digital applications.

Technical Specifications

Digital Shift Registers I74F166D-T attributes and parameters. Explore more Digital Shift Registers devices from NXP Semiconductors

Specs

Additional Features:

CLOCK INHIBIT

Count Direction:

RIGHT

Family:

F/FAST

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Supply Current (ICC):

70 mA

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Minimum fmax:

100 MHz

Trade Compliance

I74F166D-T Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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