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I74F164N,112

NXP Semiconductors

I74F164N,112 by NXP Semiconductors

SERIAL IN PARALLEL OUT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

$1.670

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 600 parts In-Stock

1+ parts

-

100+ parts

$1.670

1k+ parts

$1.500

10k+ parts

$1.410

600

-

$1.670

$1.500

$1.410

DigiKey

USA . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.990

10k+ parts

$0.990

600

-

-

$0.990

$0.990

Verical

USA . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.875

10k+ parts

$1.762

600

-

-

$1.875

$1.762

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,127 parts In-Stock

1+ parts

$0.905

100+ parts

-

1k+ parts

-

10k+ parts

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3,127

$0.905

-

-

-

Vyrian

USA . 8,482 parts In-Stock

1+ parts

-

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8,482

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-

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Anansix

USA . 2,203 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,203

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,564 parts In-Stock

1+ parts

$0.858

100+ parts

-

1k+ parts

-

10k+ parts

-

2,564

$0.858

-

-

-

Component Stockers USA

USA . 1,326 parts In-Stock

1+ parts

$0.970

100+ parts

$0.910

1k+ parts

-

10k+ parts

-

1,326

$0.970

$0.910

-

-

Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$17.347

100+ parts

$15.786

1k+ parts

$14.225

10k+ parts

-

50

$17.347

$15.786

$14.225

-

UNI Independent Distributors

Spain . 6,322 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,322

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-

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Microchip USA

USA . 3,627 parts In-Stock

1+ parts

-

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3,627

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QUARKTWIN TECHNOLOGY LTD

USA . 3,082 parts In-Stock

1+ parts

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100+ parts

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3,082

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Technical Specifications

Digital Shift Registers I74F164N,112 attributes and parameters. Explore more Digital Shift Registers devices from NXP Semiconductors

Specs

Count Direction:

RIGHT

Family:

F/FAST

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.025 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

80000000 Hz

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

80 MHz

Trade Compliance

I74F164N,112 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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