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HTRM440/AIE,122

NXP Semiconductors

HTRM440/AIE,122 by NXP Semiconductors

Limited Part Number Data;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,759 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,759

-

-

-

-

Vyrian

USA . 3,980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,980

-

-

-

-

Anansix

USA . 2,606 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,606

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 732 parts In-Stock

1+ parts

$9.290

100+ parts

-

1k+ parts

-

10k+ parts

-

732

$9.290

-

-

-

One Stop Electronics

USA . 1,218 parts In-Stock

1+ parts

$56.100

100+ parts

-

1k+ parts

-

10k+ parts

-

1,218

$56.100

-

-

-

Component Stockers USA

USA . 789 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

789

$99.990

-

-

-

UNI Independent Distributors

Spain . 5,959 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,959

-

-

-

-

Corphita

USA . 4,433 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,433

-

-

-

-

Technical Specifications

Additional Parts HTRM440/AIE,122 attributes and parameters. Explore more Additional Parts devices from NXP Semiconductors

Technical Specifications

Other Names:

568-2208
935233870122
HTRM440/AIE

Series:

HITAG® Proximity

Type:

Read/Write

Category:

RF and Wireless
RFID Reader Modules

Package / Case:

Module

Packaging:

Bulk

Frequency:

125kHz

Interface:

RS 232

Standard Package:

8

Base Product Number:

HTRM4

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

HTRM440/AIE,122 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Authentic purchasing experiences

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