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HEF4541BPN

NXP Semiconductors

HEF4541BPN by NXP Semiconductors

TIMER, PROGRAMMABLE; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,814 parts In-Stock

1+ parts

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3,814

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Digiode

USA . 3,068 parts In-Stock

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3,068

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Anansix

USA . 350 parts In-Stock

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350

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,438 parts In-Stock

1+ parts

$5.000

100+ parts

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1,438

$5.000

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Corohmni

South Africa . 2,479 parts In-Stock

1+ parts

$5.489

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2,479

$5.489

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Native Components

USA . 522 parts In-Stock

1+ parts

$5.921

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522

$5.921

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UNI Independent Distributors

Spain . 6,475 parts In-Stock

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6,475

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Northwest PG Solutions

USA . 1,623 parts In-Stock

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$5.803

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1,623

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Corphita

USA . 749 parts In-Stock

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749

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J Silver Components DBA - Lantern Electronics

USA . 20 parts In-Stock

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20

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Technical Specifications

Timers & Real-Time Clocks HEF4541BPN attributes and parameters. Explore more Timers & Real-Time Clocks devices from NXP Semiconductors

Specs

External Data Bus Width:

0

Information Access Method:

PARALLEL, DIRECT ADDRESS

JESD-30 Code:

R-PDIP-T14

Length:

19.025 mm

No. of Terminals:

14

No. of Timers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

245

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Supply Voltage:

15 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.62 mm

Peripheral IC Type:

Trade Compliance

HEF4541BPN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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