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HEF4541BP,652

NXP Semiconductors

HEF4541BP,652 by NXP Semiconductors

TIMER, PROGRAMMABLE; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

$1.182

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 176,620 parts In-Stock

1+ parts

-

100+ parts

$1.160

1k+ parts

$0.963

10k+ parts

$0.858

176,620

-

$1.160

$0.963

$0.858

Verical

USA . 175,648 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.204

10k+ parts

$1.073

175,648

-

-

$1.204

$1.073

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,508 parts In-Stock

1+ parts

$0.463

100+ parts

-

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-

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-

3,508

$0.463

-

-

-

Vyrian

USA . 3,745 parts In-Stock

1+ parts

-

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3,745

-

-

-

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Anansix

USA . 2,477 parts In-Stock

1+ parts

-

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2,477

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ECAB

Sweden . 420 parts In-Stock

1+ parts

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420

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,274 parts In-Stock

1+ parts

$0.438

100+ parts

-

1k+ parts

-

10k+ parts

-

4,274

$0.438

-

-

-

Component Stockers USA

USA . 435,504 parts In-Stock

1+ parts

$0.500

100+ parts

$0.470

1k+ parts

$0.430

10k+ parts

$0.430

435,504

$0.500

$0.470

$0.430

$0.430

Microchip USA

USA . 376 parts In-Stock

1+ parts

$3.206

100+ parts

-

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376

$3.206

-

-

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AZTECH Wire

Italy . 630 parts In-Stock

1+ parts

$8.900

100+ parts

-

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-

10k+ parts

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630

$8.900

-

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-

Corohmni

South Africa . 5,030 parts In-Stock

1+ parts

$28.989

100+ parts

-

1k+ parts

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10k+ parts

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5,030

$28.989

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-

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Infinite Electronics LLP (Excess)

. 10,001 parts In-Stock

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10,001

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Perfect Parts

USA . 1,883 parts In-Stock

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1,883

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UNI Independent Distributors

Spain . 480 parts In-Stock

1+ parts

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480

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Northwest PG Solutions

USA . 257 parts In-Stock

1+ parts

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257

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Native Components

USA . 162 parts In-Stock

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162

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Technical Specifications

Timers & Real-Time Clocks HEF4541BP,652 attributes and parameters. Explore more Timers & Real-Time Clocks devices from NXP Semiconductors

Specs

External Data Bus Width:

0

Information Access Method:

PARALLEL, DIRECT ADDRESS

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.025 mm

No. of Terminals:

14

No. of Timers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Supply Voltage:

15 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Trade Compliance

HEF4541BP,652 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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