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HEF4021BT-Q100,118

NXP Semiconductors

HEF4021BT-Q100,118 by NXP Semiconductors

PARALLEL IN SERIAL OUT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$0.202

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,560 parts In-Stock

1+ parts

$0.202

100+ parts

$0.190

1k+ parts

$0.172

10k+ parts

$0.172

2,560

$0.202

$0.190

$0.172

$0.172

Avnet

USA . 2,560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,560

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,003 parts In-Stock

1+ parts

$0.192

100+ parts

-

1k+ parts

-

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-

3,003

$0.192

-

-

-

Vyrian

USA . 5,130 parts In-Stock

1+ parts

-

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5,130

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-

-

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DigiKey Marketplace

USA . 2,560 parts In-Stock

1+ parts

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2,560

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Anansix

USA . 1,245 parts In-Stock

1+ parts

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1,245

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Distributors (Availability)

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Corphita

USA . 2,685 parts In-Stock

1+ parts

$0.182

100+ parts

-

1k+ parts

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10k+ parts

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2,685

$0.182

-

-

-

Component Stockers USA

USA . 3,936 parts In-Stock

1+ parts

$0.220

100+ parts

$0.210

1k+ parts

$0.190

10k+ parts

-

3,936

$0.220

$0.210

$0.190

-

AZTECH Wire

Italy . 1,016 parts In-Stock

1+ parts

$9.610

100+ parts

-

1k+ parts

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1,016

$9.610

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Native Components

USA . 154 parts In-Stock

1+ parts

$53.563

100+ parts

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10k+ parts

$51.421

154

$53.563

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-

$51.421

Northwest PG Solutions

USA . 1,909 parts In-Stock

1+ parts

$58.919

100+ parts

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1,909

$58.919

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Microchip USA

USA . 9,468 parts In-Stock

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9,468

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UNI Independent Distributors

Spain . 757 parts In-Stock

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757

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Technical Specifications

Digital Shift Registers HEF4021BT-Q100,118 attributes and parameters. Explore more Digital Shift Registers devices from NXP Semiconductors

Specs

Count Direction:

RIGHT

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

250 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

20 MHz

Trade Compliance

HEF4021BT-Q100,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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