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HEF4000BT,652

NXP Semiconductors

HEF4000BT,652 by NXP Semiconductors

HEF4000BT,652 by NXP Semiconductors is a CMOS Logic Gates IC with 140 ns propagation delay at 5V. It features 2 functions, 3 inputs, and operates in industrial temperature range (-40 to 85 °C). Ideal for applications requiring fast signal processing in compact electronic devices.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 11,796 parts In-Stock

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Digiode

USA . 4,535 parts In-Stock

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Anansix

USA . 1,691 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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One Stop Electronics

USA . 1,095 parts In-Stock

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$8.000

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AZTECH Wire

Italy . 890 parts In-Stock

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$16.349

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Microchip USA

USA . 124 parts In-Stock

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$16.787

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Ampacity Inc.

Singapore . 233 parts In-Stock

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$36.000

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UNI Independent Distributors

Spain . 6,105 parts In-Stock

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Perfect Parts

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Corphita

USA . 675 parts In-Stock

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675

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Aranea Global

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Overview

Upgrade your electronics with the HEF4000BT,652 by NXP Semiconductors, a top-quality logic gate that delivers unmatched performance and reliability. As a leading manufacturer in the industry, NXP Semiconductors ensures that this product meets the highest standards for efficiency and durability. Ideal for a wide range of applications, this logic gate offers customers a valuable solution that enhances their projects with its fast propagation delay and multiple functions. Trust NXP Semiconductors to provide you with cutting-edge technology that brings your designs to life.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and reliability.

Propagation Delay At Nominal Supply

140 ns - Fast propagation delay ensures quick response times.

Surface Mount

YES - Easy to install and saves space on PCB.

No. of Functions

2 - Provides flexibility for different logic operations.

No. of Inputs

3 - Allows for multiple input signals.

Package Shape

RECTANGULAR - Fits well in standard PCB layouts.

Nominal Supply Voltage / Vsup (V)

5 - Common voltage level for compatibility with other components.

Load Capacitance (CL)

50 pF - Can handle a moderate load capacitance.

Power Supplies (V)

5/15 - Can operate with different supply voltages.

No. of Terminals

14 - Sufficient terminals for connections.

Package Style (Meter)

SMALL OUTLINE - Saves space and allows for dense PCB designs.

Maximum I (ol)

0.36 Amp - Can drive moderate current loads.

Propagation Delay (tpd)

140 ns - Provides consistent performance in timing critical applications.

Maximum Operating Temperature

85 °C - Suitable for industrial environments.

Minimum Operating Temperature

40 °C - Can withstand extreme temperature conditions.

Terminal Finish

Nickel/Palladium/Gold (Ni/Pd/Au) - Ensures good conductivity and corrosion resistance.

Terminal Position

DUAL - Allows for versatile PCB mounting options.

Maximum Seated Height

1.75 mm - Low profile design for compact applications.

Width

3.9 mm - Narrow width for space-constrained designs.

Minimum Supply Voltage (Vsup)

3 V - Can operate at lower voltage levels.

Maximum Time At Peak Reflow Temperature (s)

30 - Ensures proper soldering during assembly.

Peak Reflow Temperature °C

260 - Can withstand high temperature reflow processes.

Length

8.65 mm - Compact length for efficient PCB layout.

Temperature Grade

INDUSTRIAL - Suitable for harsh environmental conditions.

Technology

CMOS - Low power consumption and high noise immunity.

Terminal Form

GULL WING - Easy to solder and secure connection.

Terminal Pitch

1.27 mm - Standard pitch for compatibility with PCB layouts.

Maximum Supply Voltage (Vsup)

15 V - Can handle higher supply voltages without damage.

Technical Specifications

Logic Gates HEF4000BT,652 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Additional Features:

MIXED WITH 1 INVERTER

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

.36 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

3

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

140 ns

Propagation Delay (tpd):

140 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

HEF4000BT,652 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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