Loading...

HEC4538BT-T

NXP Semiconductors

HEC4538BT-T by NXP Semiconductors

HEC4538BT-T by NXP Semiconductors is a CMOS prescaler designed for automotive applications, operating b/w -40 °C and 125 °C. It features a compact 16-terminal SO package with a dual terminal position and supports power supplies of 5/15V. Ideal for reliable performance in temperature-sensitive environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,426 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,426

-

-

-

-

Vyrian

USA . 3,403 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,403

-

-

-

-

Anansix

USA . 330 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

330

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 822 parts In-Stock

1+ parts

$21.000

100+ parts

-

1k+ parts

-

10k+ parts

-

822

$21.000

-

-

-

Native Components

USA . 722 parts In-Stock

1+ parts

$35.429

100+ parts

-

1k+ parts

-

10k+ parts

$34.012

722

$35.429

-

-

$34.012

Northwest PG Solutions

USA . 973 parts In-Stock

1+ parts

$38.972

100+ parts

-

1k+ parts

-

10k+ parts

-

973

$38.972

-

-

-

UNI Independent Distributors

Spain . 5,453 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,453

-

-

-

-

Corphita

USA . 2,590 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,590

-

-

-

-

Overview

Unlock precision and reliability in your designs with the HEC4538BT-T from NXP Semiconductors. Renowned for its high-quality automotive-grade components, NXP ensures this prescaler and multivibrator meets the toughest demands while offering excellent performance in diverse applications. With robust temperature resilience and a compact design, the HEC4538BT-T delivers unmatched stability and efficiency, empowering your innovations and driving success in any project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and helps protect the internal components from environmental factors, making this component suitable for various applications.

Surface Mount: YES

Surface mount capability allows for smaller PCB designs and easier automated assembly, increasing manufacturing efficiency.

Package Shape: RECTANGULAR

The rectangular shape is ideal for efficient space utilization on PCBs, accommodating higher terminal counts without increasing the board's footprint.

Power Supplies (V): 5/15

The flexibility of dual supply voltage (5V and 15V) caters to a wide range of applications, enhancing compatibility with different circuit designs.

No. of Terminals: 16

With 16 terminals, this device offers sufficient connectivity options while maintaining a compact form factor for versatile use.

Package Style (Meter): SMALL OUTLINE

The small outline package reduces space requirements on the PCB, allowing more components to be integrated into the same area.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C ensures reliable performance in high-temperature environments, protecting the device from thermal stress.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C makes this component suitable for extreme conditions, such as automotive and industrial applications.

Terminal Position: DUAL

Dual terminal position aids in flexible layout design options, making it easier to work with in diverse circuit configurations.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this temperature grading ensures that the component can withstand the rigorous conditions typical in vehicles.

Technology: CMOS

The use of CMOS technology provides low power consumption and high noise immunity, making the device efficient for battery-operated applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and improve electrical connections, enhancing reliability and manufacturability.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm enables compact designs while allowing for efficient soldering and reliable electrical connections.

Technical Specifications

Prescaler & Multivibrators HEC4538BT-T attributes and parameters. Explore more Prescaler & Multivibrators devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Sub-Category:

Prescaler/Multivibrators

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

HEC4538BT-T Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 13